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| low-power embedded pentium ? processor with mmx? technology advance information datasheet product features n support for mmx? technology n low-power 0.25 micron process technology 1.9 v (166/266 mhz) core supply for ppga 1.8 v (166 mhz) or 2.0 v (266 mhz) core supply for hl-pbga 2.5 v i/o interface (166/266 mhz) n 32-bit cpu with 64-bit data bus n fractional bus operation 166-mhz core/66-mhz bus 266-mhz core/66-mhz bus n superscalar architecture enhanced pipelines two pipelined integer units capable of two instructions/clock pipelined mmx technology pipelined floating-point unit n separate code and data caches 16-kbyte code, 16-kbyte write-back data mesi cache protocol n compatible with large software base ms-dos*, windows*, os/2*, unix* n 4-mbyte pages for increased tlb hit rate n ieee 1149.1 boundary scan n advanced design features deeper write buffers enhanced branch prediction feature virtual mode extensions n internal error detection features n on-chip local apic controller n power management features system management mode clock control n 296-pin ppga or 352-ball hl-pbga the low-power embedded pentium processor with mmx technology in the hl-pbga package is also available in extended temperature ranges from -40c to +115c. for more information, see the extended temperature pentium ? processor with mmx? technology datasheet, order number 273232. order number: 273184-002 may, 1999 notice: this document contains information on products in the sampling and initial production phases of development. the specifications are subject to change without notice. verify with your local intel sales office that you have the latest datasheet before finalizing a design.
advance information datasheet information in this document is provided in connection with intel products. no license, express or implied, by estoppel or othe rwise, to any intellectual property rights is granted by this document. except as provided in intel's terms and conditions of sale for such products, inte l assumes no liability whatsoever, and intel disclaims any express or implied warranty, relating to sale and/or use of intel products including liabil ity or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property righ t. intel products are not intended for use in medical, life saving, or life sustaining applications. intel may make changes to specifications and product descriptions at any time, without notice. designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." int el reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. the low-power embedded pentium ? processor with mmx? technology may contain design defects or errors known as errata which may cause the product to deviate from published specifications. current characterized errata are available on request. contact your local intel sales office or your distributor to obtain the latest specifications and before placing your product o rder. copies of documents which have an ordering number and are referenced in this document, or other intel literature may be obtaine d by calling 1-800- 548-4725 or by visiting intel's website at http://www.intel.com. copyright ? intel corporation, 1999 *third-party brands and names are the property of their respective owners. advance information datasheet 3 low-power embedded pentium ? processor with mmx? technology contents 1.0 introduction .................................................................................................................. 7 1.1 processor features ............................................................................................... 7 2.0 architecture overview ............................................................................................. 8 2.1 pentium ? processor family architecture .............................................................. 9 2.2 pentium ? processor with mmx? technology ....................................................12 2.2.1 full support for intel mmx? technology ..............................................12 2.2.2 16-kbyte code and data caches...........................................................13 2.2.3 improved branch prediction ...................................................................13 2.2.4 enhanced pipeline .................................................................................13 2.2.5 deeper write buffers..............................................................................13 2.3 0.25 micron technology ......................................................................................13 3.0 packaging information ...........................................................................................14 3.1 differences from desktop processors.................................................................14 3.2 ppga pinout and pin descriptions .....................................................................15 3.3 hl-pbga pinout and pin descriptions ...............................................................19 3.4 design notes.......................................................................................................23 3.5 pin quick reference ...........................................................................................23 3.6 bus fraction (bf) selection ................................................................................29 3.7 the cpuid instruction ........................................................................................30 3.8 boundary scan chain list...................................................................................32 3.9 pin reference tables..........................................................................................33 3.10 pin grouping according to function....................................................................35 3.11 mechanical specifications ...................................................................................36 3.11.1 ppga package mechanical diagrams...................................................36 3.11.2 hl-pbga package mechanical diagrams .............................................38 3.12 thermal specifications ........................................................................................39 3.12.1 measuring thermal values ....................................................................39 3.12.2 thermal equations and data..................................................................39 3.12.3 airflow calculations for maximum and typical power............................40 3.12.4 ppga package thermal resistance information ..................................41 3.12.5 hl-pbga package thermal resistance information.............................42 4.0 electrical specifications ........................................................................................43 4.1 absolute maximum ratings.................................................................................43 4.2 dc specifications ................................................................................................43 4.2.1 power sequencing .................................................................................43 4.3 ac specifications ................................................................................................46 4.3.1 power and ground .................................................................................46 4.3.2 decoupling recommendations ..............................................................46 4.3.3 connection specifications ......................................................................47 4.3.4 ac timings.............................................................................................47 4.4 i/o buffer models ................................................................................................55 4.4.1 buffer model parameters .......................................................................56 4.5 signal quality specifications ...............................................................................58 4.5.1 overshoot...............................................................................................58 low-power embedded pentium ? processor with mmx? technology 4 advance information datasheet 4.5.2 undershoot............................................................................................. 59 4.5.3 ringback ................................................................................................ 60 4.5.4 settling time .......................................................................................... 61 4.5.5 measurement methodology.................................................................... 62 4.6 measuring maximum overshoot, undershoot and ringback.............................. 63 4.7 measuring overshoot threshold duration .......................................................... 63 4.8 measuring undershoot threshold duration ........................................................ 63 figures 1pentium ? processor with mmx? technology block diagram............................ 11 2 ppga package top side view ........................................................................... 15 3 ppga package pin side view ............................................................................ 16 4 hl-pbga package top side view ..................................................................... 19 5 hl-pbga package pin side view ...................................................................... 20 6 eax bit assignments for cpuid......................................................................... 30 7 edx bit assignments for cpuid......................................................................... 30 8 ppga package dimensions ............................................................................... 36 9 hl-pbga package dimensions.......................................................................... 38 10 technique for measuring t c ............................................................................... 40 11 thermal resistance vs. heatsink height, ppga packages ............................... 41 12 thermal resistance vs. airflow for hl-pbga package...................................... 42 13 clock waveform.................................................................................................. 52 14 valid delay timings ............................................................................................ 52 15 float delay timings ............................................................................................ 52 16 setup and hold timings...................................................................................... 53 17 reset and configuration timings........................................................................ 53 18 test timings........................................................................................................ 54 19 test reset timings ............................................................................................. 54 20 first order input buffer model............................................................................. 55 21 first order output buffer model.......................................................................... 56 22 maximum overshoot level, overshoot threshold level and overshoot threshold duration ............................................................................ 59 23 maximum undershoot level, undershoot threshold level and undershoot threshold duration ................................................................... 60 24 maximum ringback associated with the signal high state................................ 61 25 maximum ringback associated with the signal low state................................. 61 26 settling time ....................................................................................................... 62 advance information datasheet 5 low-power embedded pentium ? processor with mmx? technology tables 1 signals removed from the low-power embedded pentium ? processor with mmx? technology .....................................................................................14 2 pin cross reference by pin name (ppga package) .......................................17 3 no connect, power supply and ground pin cross reference (ppga package) .....................................................................18 4 pin cross reference by pin name (hl-pbga package) .................................21 5 no connect, power supply and ground pin cross reference (hl-pbga package) ...............................................................22 6 quick pin reference .........................................................................................23 7 bus frequency selection ....................................................................................30 8 edx bit assignment definitions for cpuid.........................................................31 9 output pins..........................................................................................................33 10 input pins ............................................................................................................34 11 input/output pins.................................................................................................35 12 pin functional grouping......................................................................................35 13 ppga package dimensions................................................................................37 14 hl-pbga package dimensions..........................................................................38 15 thermal resistances for ppga packages..........................................................41 16 thermal resistances for hl-pbga packages....................................................42 17 absolute maximum ratings.................................................................................43 18 v cc and t case specifications.............................................................................44 19 dc specifications ................................................................................................44 20 i cc specifications ................................................................................................44 21 power dissipation requirements for thermal design.........................................45 22 input and output characteristics.........................................................................45 23 low-power embedded pentium? processor with mmx? technology ac specifications ........................................................48 24 apic ac specifications.......................................................................................51 25 notes to tables 23 and 24...................................................................................51 26 parameters used in the specification of the first order input buffer model.......56 27 parameters used in the specification of the first order output buffer model....56 28 signal to buffer type...........................................................................................57 29 input, output and bidirectional buffer model parameters for ppga package...........................................................................57 30 preliminary input, output and bidirectional buffer model parameters for hl-pbga package.....................................................................57 31 input buffer model parameters: d (diodes) ........................................................58 32 overshoot specification summary ......................................................................58 33 undershoot specification summary ....................................................................59 low-power embedded pentium ? processor with mmx? technology advance information datasheet 7 1.0 introduction the low-power embedded pentium ? processor with mmx? technology extends the pentium processor family, providing additional performance and low power for embedded applications. the low-power embedded pentium processor with mmx technology is compatible with the entire installed base of applications for ms-dos*, windows*, os/2*, and unix* and is one of the major microprocessors to support intel mmx technology. furthermore, the low-power embedded pentium processor with mmx technology has superscalar architecture which can execute two instructions per clock cycle, and enhanced branch prediction and separate caches also increase performance. the pipelined floating-point unit delivers workstation level performance. separate code and data caches reduce cache conflicts while remaining software transparent. the low-power embedded pentium processor with mmx technology has 4.5 million transistors, is built on intels 0.25 micron manufacturing process technology and has full sl enhanced power management features including system management mode (smm) and clock control. the low- power embedded pentium processor with mmx technology is available in a 296-pin plastic pin grid array (ppga) or 352-ball high-thermal low-profileCplastic ball grid array (hl-pbga). the hl-pbga package allows designers to use surface mount technology to create small form- factor designs. the additional sl enhanced features, low-power dissipation and ppga or hl- pbga package make the low-power embedded pentium processor with mmx technology ideal for embedded designs. the low-power embedded pentium processor with mmx technology in the hl-pbga package is available in extended temperature ranges from -40c to +115c. for details, see the extended temperature pentium ? processor with mmx? technology datasheet, order number 273232. 1.1 processor features the low-power embedded pentium processors with mmx technology for high performance embedded applications (166 and 266 mhz) are fully compatible with the existing pentium processors with mmx technology (200 and 233 mhz) with the following differences: voltage supplies, power consumption, and performance. additionally, pentium processors with mmx technology are socket compatible with the pentium processor (100, 133, and 166 mhz), making it possible to design a flexible motherboard that supports both the pentium processor and the embedded pentium processors with mmx technology (166C266 mhz). the low-power embedded pentium processor with mmx technology has all the advanced architectural and internal features of the desktop version of the pentium processor with mmx technology, except that several features have been eliminated. the differences are specified in differences from desktop processors on page 14. the low-power embedded pentium processor with mmx technology has several features which allow for high-performance embedded designs. these features include the following: ? 1.9 v core (ppga C 166/266 mhz) ? 1.8 v core (hl-pbga C 166), 2.0 v core (hl-pbga C 266) ? 2.5 v i/o buffer v cc3 inputs to reduce power consumption ? sl enhanced feature set this document should be used in conjunction with embedded pentium ? processor family developers manual (order number 273204). low-power embedded pentium ? processor with mmx? technology 8 advance information datasheet 2.0 architecture overview the low-power embedded pentium processor with mmx technology extends the family of pentium processors with mmx technology. it is binary compatible with the 8086/88, 80286, intel386? dx, intel386 sx,intel486? sx, inteldx2?, inteldx4?, and pentium processors with voltage reduction technology (75C150 mhz). the embedded pentium processor family consists of the embedded pentium processor (100, 133, and 166 mhz), the embedded pentium processor with voltage reduction technology (133 mhz), the embedded pentium processor with mmx technology (200, 233 mhz), and the low-power embedded pentium processor with mmx technology (166, 266 mhz). the low-power embedded pentium processor with mmx technology contains all of the features of previous intel architecture processors and provides significant enhancements and additions, including the following: ? support for mmx? technology ? superscalar architecture ? enhanced branch prediction algorithm ? pipelined floating-point unit ? improved instruction execution time ? separate 16-kbyte code cache and 16-kbyte data cache ? writeback mesi protocol in the data cache ? 64-bit data bus ? enhanced bus cycle pipelining ? address parity ? internal parity checking ? execution tracing ? performance monitoring ? ieee 1149.1 boundary scan ? system management mode ? virtual mode extensions ? 0.25 micron process technology ? sl power management features ? pool of four write buffers used by both pipes low-power embedded pentium ? processor with mmx? technology advance information datasheet 9 2.1 pentium ? processor family architecture the application instruction set of the pentium processor family includes the complete intel486 cpu family instruction set with extensions to accommodate some of the additional functionality of the pentium processors. all application software written for the intel386 and intel486 family microprocessors will run on the pentium processors without modification. the on-chip memory management unit (mmu) is completely compatible with the intel386 and intel486 families of processors. the pentium processors implement several enhancements to increase performance. the two instruction pipelines and the floating-point unit on pentium processors are capable of independent operation. each pipeline issues frequently used instructions in a single clock. together, the dual pipes can issue two integer instructions in one clock, or one floating-point instruction (under certain circumstances, two floating-point instructions) in one clock. branch prediction is implemented in the pentium processors. to support this, pentium processors implement two prefetch buffers, one that prefetches code in a linear fashion, and one that prefetches code according to the branch target buffer (btb) so that code is almost always prefetched before it is needed for execution. the floating-point unit has been completely redesigned over the intel486 processor. faster algorithms provide up to 10x speed-up for common operations including add, multiply, and load. pentium processors include separate code and data caches integrated on-chip to meet performance goals. each cache has a 32-byte line size and is 4-way set associative. each cache has a dedicated translation lookaside buffer (tlb) to translate linear addresses to physical addresses. the data cache is configurable to be writeback or writethrough on a line-by-line basis and follows the mesi protocol. the data cache tags are triple ported to support two data transfers and an inquire cycle in the same clock. the code cache is an inherently write-protected cache. the code cache tags are also triple ported to support snooping and split line accesses. individual pages can be configured as cacheable or non-cacheable by software or hardware. the caches can be enabled or disabled by software or hardware. the pentium processors have increased the data bus to 64 bits to improve the data transfer rate. burst read and burst writeback cycles are supported by the pentium processors. in addition, bus cycle pipelining has been added to allow two bus cycles to be in progress simultaneously. the pentium processors mmu contains optional extensions to the architecture that allow 4-kbyte and 4-mbyte page sizes. the pentium processors have added significant data integrity and error detection capability. data parity checking is still supported on a byte-by-byte basis. address parity checking and internal parity checking features have been added along with a new exception, the machine check exception. low-power embedded pentium ? processor with mmx? technology 10 advance information datasheet as more and more functions are integrated on-chip, the complexity of board level testing is increased. to address this, the pentium processors have increased test and debug capability. the pentium processors implement ieee boundary scan (standard 1149.1). in addition, the pentium processors have specified four breakpoint pins that correspond to each of the debug registers and externally indicate a breakpoint match. execution tracing provides external indications when an instruction has completed execution in either of the two internal pipelines, or when a branch has been taken. system management mode (smm) has been implemented along with some extensions to the smm architecture. enhancements to virtual 8086 mode have been made to increase performance by reducing the number of times it is necessary to trap to a virtual 8086 monitor. figure 1 shows a block diagram of the pentium processor with mmx technology. the block diagram shows the two instruction pipelines, the u pipe and v pipe. the u-pipe can execute all integer and floating-point instructions. the v-pipe can execute simple integer instructions and the fxch floating-point instructions. the separate code and data caches are shown. the data cache has two ports, one for each of the two pipes (the tags are triple ported to allow simultaneous inquire cycles). the data cache has a dedicated translation lookaside buffer (tlb) to translate linear addresses to the physical addresses used by the data cache. low-power embedded pentium ? processor with mmx? technology advance information datasheet 11 figure 1. pentium ? processor with mmx? technology block diagram a5920-01 bus unit page unit branch target buffer prefetch address code cache 16 kbytes control rom address generate (u pipeline) address generate (v pipeline) prefetch buffers instruction decode control unit floating-point unit instruction pointer apic 64-bit data bus 64-bit data bus 32-bit address bus 32-bit address bus control 64 32 32 32 32 32 32 control data 80 80 128 tlb data cache 16 kbytes tlb branch verif. & target addr. control multiply register file divide add mmx? tech- nology unit integer register file alu (u pipeline) alu (v pipeline) barrel shifter v pipeline connection u pipeline connection low-power embedded pentium ? processor with mmx? technology 12 advance information datasheet the code cache, branch target buffer and prefetch buffers are responsible for getting raw instructions into the execution units of the pentium processor. instructions are fetched from the code cache or from the external bus. branch addresses are remembered by the branch target buffer. the code cache tlb translates linear addresses to physical addresses used by the code cache. the decode unit decodes the prefetched instructions so the pentium processor can execute the instruction. the control rom contains the microcode which controls the sequence of operations that must be performed to implement the pentium processor architecture. the control rom unit has direct control over both pipelines. the pentium processor contains a pipelined floating-point unit that provides a significant floating- point performance advantage over previous generations of processors. in addition to the smm features described above, the pentium processor supports clock control. when the clock to the processor is stopped, power dissipation is virtually eliminated. the combination of these improvements makes the pentium processor a good choice for low-power embedded designs. the pentium processor supports fractional bus operation. this allows the internal processor core to operate at high frequencies, while communicating with the external bus at lower frequencies. the low-power embedded pentium processor with mmx technology contains an on-chip advanced programmable interrupt controller (apic). this function is reserved for future multi-processing function. the architectural features introduced in this section are more fully described in the embedded pentium ? processor family developer's manual (order number 273204). 2.2 pentium ? processor with mmx? technology the pentium processor with mmx technology for high-performance embedded designs is a significant addition to the pentium processor family. available at 166, 200, 233, and 266 mhz, it is the first microprocessor to support intel mmx technology. the pentium processor with mmx technology is both software and pin compatible with previous members of the pentium processor family. it contains 4.5 million transistors and is manufactured on lntel's enhanced 0.35 micron (200/233 mhz) or 0.25 micron (166/266 mhz) cmos process, which allows voltage reduction technology for low power and high density. in addition to the architecture described in the previous section for the pentium processor family, the pentium processor with mmx technology has several additional micro-architectural enhancements, which are described in the next section. 2.2.1 full support for intel mmx? technology mmx technology is based on the simd technique (single instruction, multiple data) which enables increased performance on a wide variety of multimedia and communications applications. fifty-seven new instructions and four new 64-bit data types are supported in the pentium processor with mmx technology. all existing operating system and application software are fully- compatible. low-power embedded pentium ? processor with mmx? technology advance information datasheet 13 2.2.2 16-kbyte code and data caches on-chip level-1 data and code cache sizes are 16 kbytes each and are 4-way set associative on the pentium processor with mmx technology. large separate internal caches improve performance by reducing average memory access time and providing fast access to recently-used instructions and data. the instruction and data caches can be accessed simultaneously while the data cache supports two data references simultaneously. the data cache supports a write-back (or alternatively, write- through, on a line-by-line basis) policy for memory updates. 2.2.3 improved branch prediction dynamic branch prediction uses the branch target buffer (btb) to boost performance by predicting the most likely set of instructions to be executed. the btb has been improved on the pentium processor with mmx technology to increase its accuracy. this processor has four prefetch buffers that can hold up to four successive code streams. 2.2.4 enhanced pipeline an additional pipeline stage has been added and the pipeline has been enhanced to improve performance. the integration of the mmx technology pipeline with the integer pipeline is very similar to that of the floating-point pipeline. under some circumstances, two mmx instructions or one integer and one mmx instruction can be paired and issued in one clock cycle to increase throughput. the enhanced pipeline is described in more detail in the embedded pentium ? processor family developers manual (order number 273204). 2.2.5 deeper write buffers a pool of four write buffers is now shared between the dual pipelines to improve memory write performance. 2.3 0.25 micron technology the 0.25 micron technology is the state-of-the-art cmos manufacturing process intel unveiled on april 12, 1997, enabling the use of lower core supply to sub-2 v. as a result, the low-power embedded pentium processor with mmx technology consumes significantly less power at even higher speeds. low-power embedded pentium ? processor with mmx? technology 14 advance information datasheet 3.0 packaging information 3.1 differences from desktop processors the following features have been eliminated in the low-power embedded pentium processor with mmx technology: upgrade, dual processing (dp), and master/checker functional redundancy. table 1 lists the corresponding pins that exist on the pentium processor with mmx technology but have been removed on the low-power embedded pentium processor with mmx technology. table 1. signals removed from the low-power embedded pentium ? processor with mmx? technology signal function adsc# additional address status. this signal is mainly used for large or standalone l2 cache memory subsystem support required for high-performance desktop or server models. brdyc# additional burst ready. this signal is mainly used for large or standalone l2 cache memory subsystem support required for high-performance desktop or server models. cputyp cpu type. this signal is used for dual processing systems. d/p# dual/primary processor identification. this signal is only used for an upgrade processor. frcmc# functional redundancy checking. this signal is only used for error detection via processor redundancy and requires two pentium processors (master/checker). pbgnt# private bus grant. this signal is only used for dual processing systems. pbreq# private bus request. this signal is used only for dual processing systems. phit# private hit. this signal is only used for dual processing systems. phitm# private modified hit. this signal is only used for dual processing systems. low-power embedded pentium ? processor with mmx? technology advance information datasheet 15 3.2 ppga pinout and pin descriptions the text orientation on the top side view drawings in this section represents the orientation of the ink mark on the actual packages. (note that the text shown in this section is not the actual text that will be marked on the packages). figure 2. ppga package top side view 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 an am al ak aj ah ag af ae ad ac ab aa z y x w v u t s r q p n m l k j h g f e d c b a an am al ak aj ah ag af ae ad ac ab aa z y x w v u t s r q p n m l k j h g f e d c b a 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 top side view vss a30 a3 a29 a31 vss a28 a25 a26 a27 a22 a24 a21 a23 vcc3 vss nc intr nmi r/s# smi# init ignne# pen# bf0 nc bf1 bf2 nc stpclk# vcc3 vss vcc3 nc nc nc trst# nc tms tdo tdi tck vcc3 picd1 d0 picd0 d2 picclk d3 d1 d5 d7 d4 d6 d8 d14 vcc3 dp0 d10 d13 d18 d9 d11 d15 nc a4 a7 a5 a6 a8 a11 a9 a10 vss a12 a13 vcc3 a14 a15 a16 a17 a18 a19 a20 reset nc clk scyc be7# be6# be5# be4# be3# be2# be1# be0# a20m# buschk# hit# ads# flush# w/r# hitm# d/c# hlda nc eads# pwt ap breq nc nc vcc2det nc vcc3 vcc3 vcc3 vcc3 vcc2 vcc2 vcc2 vcc2 vcc2 vcc3 vcc3 vcc3 vcc3 vcc3 vcc3 vcc3 vcc3 vcc3 vcc3 vcc3 vcc3 nc d12 d17 d16 d22 dp1 d21 d29 vcc3 dp19 d24 vss d23 dp2 d26 d25 d28 d27 d30 d29 dp3 d31 d33 d32 d35 d34 d37 d36 d39 d38 d40 dp4 d44 d45 d41 d48 d47 d43 nc d50 nc nc vcc3 vcc3 vcc3 vcc3 vcc3 vcc2 vcc2 vcc2 vcc2 vcc2 vcc2 pcd lock# smiact# vss vcc2 apchk# pchk# nc vss prdy vc nc vss wb/wt# buschk# nc na# boff# brdyc# ken# brdy# ewbe# inv# ahold# cache# bp3 mi/o# bp2 ferr# pm1bp1 pm0bp0# dp7 ierr# d63 d60 d62 d61 d58 d59 d57 d53 d55 d49 d51 d52 d54 vcc2 vcc2 vcc2 vcc2 vcc2 vcc2 vcc2 vcc2 vcc2 vcc2 vcc2 vcc2 vss vss vss vss vss vss vss vss vss vss vss vss vss vss vss vss vss vss vss vss vss vss vss vss vss vss vss vss vss vss vss vss vss dp6 vss vss vss vss vss vss vss vss vss vss d42 d46 dp5 vss vcc2 d56 000260 nc nc boff# hold d20 d19 low-power embedded pentium ? processor with mmx? technology 16 advance information datasheet figure 3. ppga package pin side view 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 an am al ak aj ah ag af ae ad ac ab aa z y x w v u t s r q p n m l k j h g f e d c b a an am al ak aj ah ag af ae ad ac ab aa z y x w v u t s r q p n m l k j h g f e d c b a 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 vss a30 a3 a29 a31 vss a28 a25 a26 a27 a22 a24 a21 a23 vcc3 vss nc intr nmi r/s# smi# init ignne# pen# bf0 nc bf1 bf2 nc stpclk# vcc3 vss vcc3 nc nc nc trst# nc tms tdo tck vcc3 picd1 d0 picd0 d2 picclk d3 d1 d5 d7 d4 d6 d8 d14 vcc3 dp0 d10 d13 d18 d9 d11 d15 nc a4 a7 a5 a6 a8 a11 a9 a10 vss a12 a13 vcc3 a14 a15 a16 a17 a18 a19 a20 reset nc clk scyc be7# be6# be5# be4# be3# be2# be1# be0# a20m# buschk# hit# ads# flush# w/r# hitm# d/c# hlda nc eads# pwt ap breq nc nc vcc2det nc vcc3 vcc3 vcc3 vcc3 vcc2 vcc2 vcc2 vcc2 vcc2 vcc3 vcc3 vcc3 vcc3 vcc3 vcc3 vcc3 vcc3 vcc3 vcc3 vcc3 vcc3 nc d12 d17 d16 d22 dp1 d21 d29 vcc3 dp19 d24 vss d23 dp2 d26 d25 d28 d27 d30 d29 dp3 d31 d33 d32 d35 d34 d37 d36 d39 d38 d40 dp4 d44 d45 d41 d48 d47 d43 nc d50 nc nc vcc3 vcc3 vcc3 vcc3 vcc3 vcc2 vcc2 vcc2 vcc2 vcc2 vcc2 pcd lock# smiact# vss vcc2 apchk# pchk# nc vss prdy vc nc vss wb/wt# buschk# nc na# boff# brdyc# ken# brdy# ewbe# inv# ahold# cache# bp3 mi/o# bp2 ferr# pm1bp1 pm0bp0# dp7 ierr# d63 d60 d62 d61 d58 d59 d57 d53 d55 d49 d51 d52 d54 vcc2 vcc2 vcc2 vcc2 vcc2 vcc2 vcc2 vcc2 vcc2 vcc2 vcc2 vcc2 vss vss vss vss vss vss vss vss vss vss vss vss vss vss vss vss vss vss vss vss vss vss vss vss vss vss vss vss vss vss vss vss vss dp6 vss vss vss vss vss vss vss vss vss vss d42 d46 dp5 vss vcc2 d56 pin side view 000261 nc nc hold idt d20 tdi d19 low-power embedded pentium ? processor with mmx? technology advance information datasheet 17 table 2. pin cross reference by pin name (ppga package) (sheet 1 of 2) pin location pin location pin location pin location address a3 al35 a11 al31 a19 ak22 a27 ag33 a4 am34 a12 al29 a20 al21 a28 ak36 a5 ak32 a13 ak28 a21 af34 a29 ak34 a6 an33 a14 al27 a22 ah36 a30 am36 a7 al33 a15 ak26 a23 ae33 a31 aj33 a8 am32 a16 al25 a24 ag35 a9 ak30 a17 ak24 a25 aj35 a10 an31 a18 al23 a26 ah34 data d0 k34 d16 b32 d32 c15 d48 d04 d1 g35 d17 c31 d33 d16 d49 e05 d2 j35 d18 a33 d34 c13 d50 d02 d3 g33 d19 d28 d35 d14 d51 f04 d4 f36 d20 b30 d36 c11 d52 e03 d5 f34 d21 c29 d37 d12 d53 g05 d6 e35 d22 a31 d38 c09 d54 e01 d7 e33 d23 d26 d39 d10 d55 g03 d8 d34 d24 c27 d40 d08 d56 h04 d9 c37 d25 c23 d41 a05 d57 j03 d10 c35 d26 d24 d42 e09 d58 j05 d11 b36 d27 c21 d43 b04 d59 k04 d12 d32 d28 d22 d44 d06 d60 l05 d13 b34 d29 c19 d45 c05 d61 l03 d14 c33 d30 d20 d46 e07 d62 m04 d15 a35 d31 c17 d47 c03 d63 n03 control a20m# ak08 breq aj01 hitm# al05 pm1/bp1 r04 ads# aj05 buschk# al07 hlda aj03 prdy ac05 ahold v04 cache# u03 hold ab04 pwt al03 ap ak02 d/c# ak04 ierr# p04 r/s# ac35 apchk# ae05 dp0 d36 ignne# aa35 reset ak20 be0# al09 dp1 d30 init aa33 scyc al17 be1# ak10 dp2 c25 intr/ lint0 ad34 smi# ab34 be2# al11 dp3 d18 inv u05 smiact# ag03 be3# ak12 dp4 c07 ken# w05 tck m34 be4# al13 dp5 f06 lock# ah04 tdi n35 be5# ak14 dp6 f02 m/io# t04 tdo n33 be6# al15 dp7 n05 na# y05 tms p34 be7# ak16 eads# am04 nmi/lint1 ac33 trst# q33 boff# z04 ewbe# w03 pcd ag05 vcc2det# al01 bp2 s03 ferr# q05 pchk# af04 w/r# am06 low-power embedded pentium ? processor with mmx? technology 18 advance information datasheet bp3 s05 flush# an07 pen# z34 wb/wt# aa05 brdy# x04 hit# ak06 pm0/bp0 q03 apic picclk h34 picd0 j33 picd1 [apicen] l35 clock control bf0 y33 bf1 x34 bf2 w33 clk ak18 stpclk# v34 table 3. no connect, power supply and ground pin cross reference (ppga package) v cc2 a07 a15 j01 q01 w01 ac01 an09 an15 a09 a17 l01 s01 y01 ae01 an11 an17 a11 g01 n01 u01 aa01 ag01 an13 an19 a13 v cc3 a19 a27 j37 q37 u37 aa37 ag37 an25 a21 a29 l37 s37 w37 ac37 an29 an23 a23 e37 l33 t34 y37 ae37 an27 an21 a25 g37 n37 u33 v ss b06 b20 k02 r36 x36 af02 am12 am26 b08 b22 k36 t02 z02 af36 am14 am28 b10 b24 m02 t36 z36 ah02 am16 am30 b12 b26 m36 u35 ab02 aj37 am18 an37 b14 b28 p02 v02 ab36 al37 am20 b16 h02 p36 v36 ad02 am08 am22 b18 h36 r02 x02 ad36 am10 am24 no connect (nc) a03 s33 ac03 an01 a37 s35 ad04 an03 b02 w35 ae03 an05 c01 y03 ae35 an35 q35 y35 al19 r34 aa03 am02 note: shaded pins differ functionally from the pentium ? processor with mmx? technology pinout. table 2. pin cross reference by pin name (ppga package) (sheet 2 of 2) pin location pin location pin location pin location low-power embedded pentium ? processor with mmx? technology advance information datasheet 19 3.3 hl-pbga pinout and pin descriptions figure 4. hl-pbga package top side view a4694-01 a 26 c b e d g f j h l k n m r p u t w v aa y ac ab ae ad af a c b e d g f j h l k n m r p u t w v aa y ac ab ae ad af 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 hold inc breq hlda v ss bp3 v cc3 v ss v ss v ss ap lock# v ss d/c# eads# w/r# flush# be0# buschk# hit# ads# v ss pwt inc inc inc inc inc inc prdy apchk# v ss v ss v ss pchk# v ss v ss smiact# v ss v cc2 v cc2 v cc2 v cc2 v cc2 pcd hitm# v ss inc v cc3 v cc3 v cc3 v cc3 v cc2 v cc3 v ss v ss v cc2 v ss v cc3 be2# be3# be5# be6# nc a20 a17 a15 a14 a13 a16 reset a19 a18 v cc3 v ss v cc2 v ss v cc2 a11 a10 v ss a7 a3 a29 nmi/lint1 init v cc2 v ss tck bf[2] inc v ss v ss picd[0] d1 d0 inc inc d8 d12 d14 d15 d6 d4 d5 d7 v ss v cc3 v ss dp0 d9 v ss v cc3 v cc3 d11 d13 d16 v ss v cc3 dp1 d19 d21 v ss d20 d28 d30 dp3 d29 d33 d31 d32 d35 d39 d40 d34 d36 d37 d38 d27 d25 d24 v ss dp2 d22 v ss d26 v ss v ss v ss v cc3 v cc2 v cc3 v cc3 v cc3 v ss v cc3 v cc3 v cc2 v cc2 v ss v ss v cc3 v cc2 v cc2 d49 d53 d56 d50 d55 v ss d42 dp4 d44 d41 d43 inc d46 d48 d58 d62 inc d52 dp6 d59 d47 d60 dp7 ferr# bp2 v ss inv brdy# na# cache# d51 inc inc d54 d57 d61 d63 ierr# pm0/bp0 pm1/bp1 m/io# ewbe# ahold ken# boff# wb/wt# d45 v ss v cc2 v cc3 v cc3 v ss dp5 v cc3 v ss v ss v ss v ss v ss v cc2 v ss v ss v cc3 v ss v cc3 v cc3 d23 v ss v cc3 d17 d18 d10 d3 v cc2 v ss v ss v ss v ss a9 a8 inc a30 a26 inc a12 inc inc inc a5 a4 a28 rs# a24 a23 a21 ignne# bf[1] nc tms intr/lint0 pen# stpclk# trst# picd[1] inc td0 inc inc inc inc inc inc inc inc inc a6 v ss scyc be4# be7# clk be1# a20m# inc v ss v ss v ss v cc2 v ss v ss v cc2 v cc3 v ss v cc3 v cc2 v ss v cc2 v cc3 v cc2 v cc3 v cc2 v cc3 v cc3 v cc3 v cc3 v ss v ss v ss inc v cc2 v cc2 v cc2 v ss v ss v ss v ss v cc2 v cc2 v cc2 v cc3 v cc2 v cc3 d2 v cc2 v cc2 v cc2 v ss v ss v ss a31 a27 a25 a22 smi# bf[0] v cc2 v ss tdi picclk v ss v cc3 v cc3 v cc3 v cc3 v cc2 v cc2 v cc3 v cc3 top view low-power embedded pentium ? processor with mmx? technology 20 advance information datasheet figure 5. hl-pbga package pin side view a4695-01 a 1 c b e d g f j h l k n m r p u t w v aa y ac ab ae ad af a c b e d g f j h l k n m r p u t w v aa y ac ab ae ad af 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 hold inc breq hlda v ss bp3 v cc3 v ss v ss v ss ap lock# v ss d/c# eads# w/r# flush# be0# buschk# hit# ads# v ss pwt inc inc inc inc inc inc prdy apchk# v ss v ss v ss pchk# v ss v ss smiact# v ss v cc2 v cc2 v cc2 v cc2 v cc2 pcd hitm# v ss inc v cc3 v cc3 v cc3 v cc3 v cc2 v cc3 v ss v ss v cc2 v ss v cc3 be2# be3# be5# be6# nc a20 a17 a15 a14 a13 a16 reset a19 a18 v cc3 v ss v cc2 v ss v cc2 a11 a10 v ss a7 a3 a29 a25 nmi/lint1 init v cc2 v ss tck bf[2] v ss inc v ss v ss picd[0] d1 d0 inc inc d8 d12 d14 d15 d6 d4 d5 d7 v ss v cc3 v ss dp0 d9 v ss v cc3 v cc3 d11 d13 d16 v ss v cc3 dp1 d19 d21 v ss d20 d28 d30 dp3 d29 d33 d31 d32 d35 d39 d40 d34 d36 d37 d38 d27 d25 d24 v ss dp2 d22 v ss d26 v ss v ss v ss v cc3 v cc2 v cc3 v cc3 v cc3 v ss v cc3 v cc3 v cc2 v cc2 v ss v ss v cc3 v cc2 v cc2 d49 d53 d56 d50 d55 v ss d42 dp4 d44 d41 d43 inc d46 d48 d58 d62 inc d52 dp6 d59 d47 d60 dp7 ferr# bp2 v ss inv brdy# na# cache# d51 inc inc d54 d57 d61 d63 ierr# pm0/bp0 pm1/bp1 m/io# ewbe# ahold ken# boff# wb/wt# d45 v ss v cc2 v cc3 v cc3 v ss dp5 v cc3 v ss v ss v ss v ss v ss v cc2 v ss v ss v cc3 v ss v cc3 v cc3 d23 v ss v cc3 d17 d18 d10 d3 v cc2 v ss v ss v ss v ss a9 a8 inc a30 a26 inc a12 inc inc inc a5 a4 a28 a23 rs# a24 a21 ignne# bf[1] nc tms intr/lint0 pen# stpclk# trst# picd[1] inc td0 inc inc inc inc inc inc inc inc inc a6 v ss scyc be4# be7# clk be1# a20m# inc v ss v ss v ss v cc2 v ss v ss v cc2 v cc3 v ss v cc3 v cc2 v ss v cc2 v cc3 v cc2 v cc3 v cc2 v cc3 v cc3 v cc3 v cc3 v ss v ss v ss inc v cc2 v cc2 v cc2 v ss v ss v ss v ss v cc2 v cc2 v cc2 v cc3 v cc2 v cc3 d2 v cc2 v cc2 v cc2 v ss v ss a31 a27 a22 smi# bf[0] v cc2 v ss tdi picclk v ss v cc3 v cc3 v cc3 v cc3 v cc2 v cc2 v cc3 v cc3 bottom view low-power embedded pentium ? processor with mmx? technology advance information datasheet 21 table 4. pin cross reference by pin name (hl-pbga package) (sheet 1 of 2) pin location pin location pin location pin location address a3 ae6 a11 ac2 a19 t2 a27 ae9 a4 af5 a12 ac1 a20 u1 a28 af7 a5 ae5 a13 ab1 a21 af11 a29 ae8 a6 af4 a14 aa1 a22 ae11 a30 af6 a7 ae4 a15 y1 a23 af10 a31 ae7 a8 ae3 a16 w1 a24 af9 a9 ae2 a17 v1 a25 ae10 a10 ad2 a18 u2 a26 af8 data d0 ac24 d16 t26 d32 h25 d48 b23 d1 ac25 d17 r25 d33 j26 d49 b22 d2 ab24 d18 r26 d34 h26 d50 b21 d3 ab25 d19 p26 d35 g25 d51 a22 d4 aa24 d20 p25 d36 g26 d52 a21 d5 y24 d21 p24 d37 f26 d53 b20 d6 aa25 d22 n24 d38 e26 d54 a20 d7 y25 d23 n25 d39 f25 d55 b19 d8 y26 d24 m24 d40 e25 d56 b18 d9 v24 d25 m25 d41 c26 d57 a18 d10 w25 d26 k24 d42 d25 d58 b17 d11 v25 d27 l25 d43 b26 d59 a17 d12 w26 d28 m26 d44 c25 d60 b16 d13 u25 d29 k25 d45 d24 d61 a16 d14 v26 d30 l26 d46 b25 d62 b15 d15 u26 d31 j25 d47 b24 d63 a15 control a20m# l3 breq c2 hitm# j3 pm1/bp1 a12 ads# h2 buschk# k2 hlda c1 prdy b4 ahold a9 cache# b10 hold a5 pwt g2 ap d2 d/c# f1 ierr# a14 r/s# af12 apchk# b3 dp0 w24 ignne# af14 reset r2 be0# k1 dp1 t25 init ae14 scyc r1 be1# l2 dp2 n26 intr/ lint0 af13 smi# ae13 be2# l1 dp3 k26 inv b9 smiact# b5 be3# m1 dp4 d26 ken# a8 tck ae22 be4# m2 dp5 c23 lock# d1 tdi ae21 be5# n1 dp6 a19 m/io# a11 tdo af21 be6# p1 dp7 b14 na# b7 tms af20 be7# n2 eads# g1 nmi/lint1 ae12 trst# af19 boff# a7 ewbe# a10 pcd g3 w/r# h1 bp2 b12 ferr# b13 pchk# c4 wb/wt# a6 low-power embedded pentium ? processor with mmx? technology 22 advance information datasheet bp3 c11 flush# j1 pen# af15 brdy# b8 hit# j2 pm0/bp0 a13 apic picclk ae23 picd0 ad23 picd1 [apicen] af22 clock control bf0 ae15 bf1 af16 bf2 ae16 clk p2 stpclk# af17 table 5. no connect, power supply and ground pin cross reference (hl-pbga package) v cc2 c6 d9 d19 r4 ab2 ac13 ac19 ae17 c8 d12 e4 u4 ab23 ac14 ac20 ae18 c21 d13 f3 v3 ac4 ac15 ac21 d5 d15 l23 y2 ac6 ac16 ac23 d7 d17 r3 aa3 ac8 ac18 ad19 v cc3 c20 d14 f23 j23 n23 v2 aa4 ac10 c22 d16 g4 k4 r23 v23 ab4 ac11 d4 d18 g23 k23 t4 w3 ac5 ac17 d6 d23 h23 m4 t23 y3 ac7 ac22 d10 e23 j4 n4 u23 y23 ac9 ad5 d11 f4 v ss b6 c14 d20 h3 p4 w4 ad6 ad16 b11 c15 d21 h24 p23 w23 ad7 ad17 c3 c16 d22 j24 r24 y4 ad8 ad18 c5 c17 e2 k3 t3 aa2 ad9 ad20 c7 c18 e3 l24 t24 aa23 ad10 ad21 c9 c19 e24 m3 u3 ab3 ad11 ad22 c10 c24 f2 m23 u24 ac3 ad13 ad24 c12 d3 f24 n3 v4 ad3 ad14 ae19 c13 d8 g24 p3 w2 ad4 ad15 ae20 no connect (nc) af18 t1 internal no connect (inc) a1 a23 b1 l4 ac26 ad26 ae26 af23 a2 a24 b2 aa26 ad1 ae1 af1 af24 a3 a25 e1 ab26 ad12 ae24 af2 af25 a4 a26 h4 ac12 ad25 ae25 af3 af26 table 4. pin cross reference by pin name (hl-pbga package) (sheet 2 of 2) pin location pin location pin location pin location low-power embedded pentium ? processor with mmx? technology advance information datasheet 23 3.4 design notes for reliable operation, always connect unused inputs to an appropriate signal level. unused active low inputs should be connected to v cc3 . unused active high inputs should be connected to gnd (v ss ). no connect (nc) pins must remain unconnected. connection of nc pins may result in component failure or incompatibility with processor steppings. 3.5 pin quick reference this section gives a brief functional description of each pin. for a detailed description, see the hardware interface chapter in the embedded pentium ? processor family developer's manual. note: all input pins must meet their ac/dc specifications to guarantee proper functional behavior. the # symbol at the end of a signal name indicates that the active or asserted state occurs when the signal is at a low voltage. when a # symbol is not present after the signal name, the signal is active, or asserted at the high voltage level. square brackets around a signal name indicate that the signal is defined only at reset. the pins are classified as input or output based on their function in master mode. see the error detection chapter of the embedded pentium ? processor family developers manual (order number 273204) for further information. table 6. quick pin reference (sheet 1 of 6) symbol type name and function a20m# i when the address bit 20 mask pin is asserted, the pentium ? processor with mmx? technology emulates the address wraparound at 1 mbyte, which occurs on the 8086. when a20m# is asserted, the processor masks physical address bit 20 (a20) before performing a lookup to the internal caches or driving a memory cycle on the bus. the effect of a20m# is undefined in protected mode. a20m# must be asserted only when the processor is in real mode. a31Ca3 i/o as outputs, the address lines of the processor along with the byte enables define the physical area of memory or i/o accessed. the external system drives the inquire address to the processor on a31 C a5. ads# o the address status indicates that a new valid bus cycle is currently being driven by the processor. ahold i in response to the assertion of address hold , the processor will stop driving the address lines (a31 C a3) and ap in the next clock. the rest of the bus will remain active so data can be returned or driven for previously issued bus cycles. ap i/o address parity is driven by the processor with even parity information on all processor generated cycles in the same clock that the address is driven. even parity must be driven back to the processor during inquire cycles on this pin in the same clock as eads# to ensure that correct parity check status is indicated. apchk# o the address parity check status pin is asserted two clocks after eads# is sampled active if the processor has detected a parity error on the address bus during inquire cycles. apchk# will remain active for one clock each time a parity error is detected. be7# C be5# be4# C be0# o i/o the byte enable pins are used to determine which bytes must be written to external memory, or which bytes were requested by the cpu for the current cycle. the byte enables are driven in the same clock as the address lines (a31-3). low-power embedded pentium ? processor with mmx? technology 24 advance information datasheet bf2Cbf0 i the bus frequency pins determine the bus-to-core frequency ratio. bf [2:0] are sampled at reset, and cannot be changed until another non-warm (1 ms) assertion of reset. additionally, bf[2:0] must not change values while reset is active. see table 7 for bus frequency selection. in order to override the internal defaults and guarantee that the bf[2:0] inputs remain stable while reset is active, these pins should be strapped directly to or through a pullup/pulldown resistor to v cc3 or ground. driving these pins with active logic is not recommended unless stability during reset can be guaranteed. during power up, reset should be asserted prior to or ramped simultaneously with the core voltage supply to the processor. boff# i the backoff input is used to abort all outstanding bus cycles that have not yet completed. in response to boff#, the processor will float all pins normally floated during bus hold in the next clock. the processor remains in bus hold until boff# is negated, at which time the processor restarts the aborted bus cycle(s) in their entirety. [apicen] picd1 i advanced programmable interrupt controller enable enables or disables the on-chip apic interrupt controller. if sampled high at the falling edge of reset, the apic is enabled. apicen shares a pin with the picd1 signal. bp3Cbp2 pm/bp1Cbp0 o the breakpoint pins (bp3 C 0) correspond to the debug registers, dr3 C dr0. these pins externally indicate a breakpoint match when the debug registers are programmed to test for breakpoint matches. bp1 and bp0 are multiplexed with the performance monitoring pins (pm1 and pm0). the pb1 and pb0 bits in the debug mode control register determine if the pins are configured as breakpoint or performance monitoring pins. the pins come out of reset configured for performance monitoring. brdy# i the burst ready input indicates that the external system has presented valid data on the data pins in response to a read or that the external system has accepted the processor data in response to a write request. this signal is sampled in the t2, t12 and t2p bus states. breq o the bus request output indicates to the external system that the processor has internally generated a bus request. this signal is always driven whether or not the processor is driving its bus. buschk# i the bus check input allows the system to signal an unsuccessful completion of a bus cycle. if this pin is sampled active, the processor will latch the address and control signals in the machine check registers. if, in addition, the mce bit in cr4 is set, the processor will vector to the machine check exception. to assure that buschk# will always be recognized, stpclk# must be deasserted any time buschk# is asserted by the system, before the system allows another external bus cycle. if buschk# is asserted by the system for a snoop cycle while stpclk# remains asserted, usually (if mce=1) the processor will vector to the exception after stpclk# is deasserted. but if another snoop to the same line occurs during stpclk# assertion, the processor can lose the buschk# request. cache# o for processor-initiated cycles, the cache pin indicates internal cacheability of the cycle (if a read), and indicates a burst writeback cycle (if a write). if this pin is driven inactive during a read cycle, the processor will not cache the returned data, regardless of the state of the ken# pin. this pin is also used to determine the cycle length (number of transfers in the cycle). clk i the clock input provides the fundamental timing for the processor. its frequency is the operating frequency of the processor external bus and requires ttl levels. all external timing parameters except tdi, tdo, tms, trst# and picd0 C 1 are specified with respect to the rising edge of clk. this pin is 2.5 v-tolerant-only on the low-power embedded pentium processor with mmx technology. it is recommended that clk begin 150 ms after v cc reaches its proper operating level. this recommendation is only to assure the long term reliability of the device. table 6. quick pin reference (sheet 2 of 6) symbol type name and function low-power embedded pentium ? processor with mmx? technology advance information datasheet 25 d/c# o the data/code output is one of the primary bus cycle definition pins. it is driven valid in the same clock as the ads# signal is asserted. d/c# distinguishes between data and code or special cycles. d63 C d0 i/o these are the 64 data lines for the processor. lines d7 C d0 define the least significant byte of the data bus; lines d63 C d56 define the most significant byte of the data bus. when the cpu is driving the data lines, they are driven during the t2, t12 or t2p clocks for that cycle. during reads, the cpu samples the data bus when brdy# is returned. dp7 C dp0 i/o these are the data parity pins for the processor. there is one for each byte of the data bus. they are driven by the processor with even parity information on writes in the same clock as write data. even parity information must be driven back to the pentium processor with voltage reduction technology on these pins in the same clock as the data to ensure that the correct parity check status is indicated by the processor. dp7 applies to d63 C d56; dp0 applies to d7 C d0. eads# i this signal indicates that a valid external address has been driven onto the processor address pins to be used for an inquire cycle. ewbe# i the external write buffer empty input, when inactive (high), indicates that a write cycle is pending in the external system. when the processor generates a write and ewbe# is sampled inactive, the processor will hold off all subsequent writes to all e- or m-state lines in the data cache until all write cycles have completed, as indicated by ewbe# being active. ferr# o the floating-point error pin is driven active when an unmasked floating-point error occurs. ferr# is similar to the error# pin on the intel387? math coprocessor. ferr# is included for compatibility with systems using ms-dos type floating-point error reporting. flush# i when asserted, the cache flush input forces the processor to write back all modified lines in the data cache and invalidate its internal caches. a flush acknowledge special cycle will be generated by the processor indicating completion of the writeback and invalidation. if flush# is sampled low when reset transitions from high to low, three-state test mode is entered. hit# o the hit indication is driven to reflect the outcome of an inquire cycle. if an inquire cycle hits a valid line in either the data or instruction cache, this pin is asserted two clocks after eads# is sampled asserted. if the inquire cycle misses the cache, this pin is negated two clocks after eads#. this pin changes its value only as a result of an inquire cycle and retains its value between the cycles. hitm# o the hit to a modified line output is driven to reflect the outcome of an inquire cycle. it is asserted after inquire cycles which resulted in a hit to a modified line in the data cache. it is used to inhibit another bus master from accessing the data until the line is completely written back. hlda o the bus hold acknowledge pin goes active in response to a hold request driven to the processor on the hold pin. it indicates that the processor has floated most of the output pins and relinquished the bus to another local bus master. when leaving bus hold, hlda will be driven inactive and the processor will resume driving the bus. if the processor has a bus cycle pending, it will be driven in the same clock that hlda is de-asserted. hold i in response to the bus hold request , the processor will float most of its output and input/output pins and assert hlda after completing all outstanding bus cycles. the processor will maintain its bus in this state until hold is de-asserted. hold is not recognized during lock cycles. the processor will recognize hold during reset. ierr# o the internal error pin is used to indicate internal parity errors. if a parity error occurs on a read from an internal array, the processor will assert the ierr# pin for one clock and then shutdown. table 6. quick pin reference (sheet 3 of 6) symbol type name and function low-power embedded pentium ? processor with mmx? technology 26 advance information datasheet ignne# i this is the ignore numeric error input. this pin has no effect when the ne bit in cr0 is set to 1. when the cr0.ne bit is 0, and the ignne# pin is asserted, the processor will ignore any pending unmasked numeric exception and continue executing floating-point instructions for the entire duration that this pin is asserted. when the cr0.ne bit is 0, ignne# is not asserted, a pending unmasked numeric exception exists (sw.es = 1), and the floating-point instruction is one of finit, fclex, fstenv, fsave, fstsw, fstcw, feni, fdisi, or fsetpm, the processor will execute the instruction in spite of the pending exception. when the cr0.ne bit is 0, ignne# is not asserted, a pending unmasked numeric exception exists (sw.es = 1), and the floating-point instruction is one other than finit, fclex, fstenv, fsave, fstsw, fstcw, feni, fdisi, or fsetpm, the processor will stop execution and wait for an external interrupt. init i the processor initialization input pin forces the processor to begin execution in a known state. the processor state after init is the same as the state after reset except that the internal caches, write buffers, and floating-point registers retain the values they had prior to init. init may not be used in lieu of reset after power up. if init is sampled high when reset transitions from high to low, the processor will perform built-in self test prior to the start of program execution. intr i an active maskable interrupt input indicates that an external interrupt has been generated. if the if bit in the eflags register is set, the processor will generate two locked interrupt acknowledge bus cycles and vector to an interrupt handler after the current instruction execution is completed. intr must remain active until the first interrupt acknowledge cycle is generated to assure that the interrupt is recognized. inv i the invalidation input determines the final cache line state (s or i) in case of an inquire cycle hit. it is sampled together with the address for the inquire cycle in the clock eads# is sampled active. ken# i the cache enable pin is used to determine whether the current cycle is cacheable or not and is consequently used to determine cycle length. when the processor generates a cycle that can be cached (cache# asserted) and ken# is active, the cycle will be transformed into a burst line fill cycle. lock# o the bus lock pin indicates that the current bus cycle is locked. the processor will not allow a bus hold when lock# is asserted (but ahold and boff# are allowed). lock# goes active in the first clock of the first locked bus cycle and goes inactive after the brdy# is returned for the last locked bus cycle. lock# is guaranteed to be de-asserted for at least one clock between back-to-back locked cycles. m/io# o the memory/input-output is one of the primary bus cycle definition pins. it is driven valid in the same clock as the ads# signal is asserted. m/io# distinguishes between memory and i/o cycles. na# i an active next address input indicates that the external memory system is ready to accept a new bus cycle although all data transfers for the current cycle have not yet completed. the processor will issue ads# for a pending cycle two clocks after na# is asserted. the processor supports up to two outstanding bus cycles. nmi i the non-maskable interrupt request signal indicates that an external non- maskable interrupt has been generated. pcd o the page cache disable pin reflects the state of the pcd bit in cr3; page directory entry or page table entry. the purpose of pcd is to provide an external cacheability indication on a page-by-page basis. pchk# o the parity check output indicates the result of a parity check on a data read. it is driven with parity status two clocks after brdy# is returned. pchk# remains low one clock for each clock in which a parity error was detected. parity is checked only for the bytes on which valid data is returned. table 6. quick pin reference (sheet 4 of 6) symbol type name and function low-power embedded pentium ? processor with mmx? technology advance information datasheet 27 pen# i the parity enable input (along with cr4.mce) determines whether a machine check exception will be taken as a result of a data parity error on a read cycle. if this pin is sampled active in the clock, a data parity error is detected. the processor will latch the address and control signals of the cycle with the parity error in the machine check registers. if, in addition, the machine check enable bit in cr4 is set to 1, the processor will vector to the machine check exception before the beginning of the next instruction. picclk i the apic interrupt controller serial data bus clock is driven into the programmable interrupt controller clock input of the pentium processor with mmx technology. picd0 C picd1 [apicen] i/o programmable interrupt controller data lines 0 C 1 of the pentium processor with mmx technology comprise the data portion of the apic 3-wire bus. they are open- drain outputs that require external pull-up resistor. these signals are multiplexed with apicen. pm/bp[1:0] o these pins function as part of the performance monitoring feature. the breakpoint 1 C 0 pins are multiplexed with the performance monitoring 1-0 pins. the pb1 and pb0 bits in the debug mode control register determine if the pins are configured as breakpoint or performance monitoring pins. the pins come out of reset configured for performance monitoring. prdy o the probe ready output pin indicates that the processor has stopped normal execution in response to the r/s# pin going active or probe mode being entered. pwt o the page writethrough pin reflects the state of the pwt bit in cr3, the page directory entry, or the page table entry. the pwt pin is used to provide an external writeback indication on a page-by-page basis. r/s# i the run/stop input is provided for use with the intel debug port. please refer to the embedded pentium ? processor family developers manual (order number 273204) for more details. reset i reset forces the processor to begin execution at a known state. all the processor internal caches will be invalidated upon the reset. modified lines in the data cache are not written back. flush# and init are sampled when reset transitions from high to low to determine if three-state test mode will be entered or if bist will be run. scyc o the split cycle output is asserted during misaligned locked transfers to indicate that more than two cycles will be locked together. this signal is defined for locked cycles only. it is undefined for cycles which are not locked. smi# i the system management interrupt causes a system management interrupt request to be latched internally. when the latched smi# is recognized on an instruction boundary, the processor enters system management mode. smiact# o an active system management interrupt active output indicates that the processor is operating in system management mode. stpclk# i assertion of the stop clock input signifies a request to stop the internal clock of the pentium processor with voltage reduction technology thereby causing the core to consume less power. when the cpu recognizes stpclk#, the processor will stop execution on the next instruction boundary, unless superseded by a higher priority interrupt, and generate a stop grant acknowledge cycle. when stpclk# is asserted, the processor will still respond to external snoop requests. tck i the testability clock input provides the clocking function for the processor boundary scan in accordance with the ieee boundary scan interface (standard 1149.1). it is used to clock state information and data into and out of the processor during boundary scan. tdi i the test data input is a serial input for the test logic. tap instructions and data are shifted into the processor on the tdi pin on the rising edge of tck when the tap controller is in an appropriate state. table 6. quick pin reference (sheet 5 of 6) symbol type name and function low-power embedded pentium ? processor with mmx? technology 28 advance information datasheet 3.6 bus fraction (bf) selection each low-power embedded pentium processor with mmx technology must be externally configured with the bf2 C bf0 pins to operate in the specified bus fraction mode. operation out of the specification is not supported. for example, a 266 mhz low-power embedded pentium processor with mmx technology supports only the 1/4 bus fraction mode and not the 2/5 mode. the bf configuration pins are provided to select the allowable bus/core ratios of 2/5 and 1/4. the low-power embedded pentium processor with mmx technology multiplies the input clk to achieve the higher internal core frequencies. the internal clock generator requires a constant frequency clk input to within 250 ps; therefore, the clk input cannot be changed dynamically. the external bus frequency is set during power-up reset through the clk pin. the low-power embedded pentium processor with mmx technology samples the bf0, bf1 and bf2 pins on the falling edge of reset to determine which bus/core ratio to use. table 7 summarizes the operation of the bf pins on the low-power embedded pentium processor with mmx technology. note: bf pins must meet a 1 ms setup time to the falling edge of reset and must not change value while reset is active . once a frequency is selected, it may not be changed with a warm reset. changing this speed or ratio requires a power on reset pulse initialization. tdo o the test data output is a serial output of the test logic. tap instructions and data are shifted out of the processor on the tdo pin on tck's falling edge when the tap controller is in an appropriate state. tms i the value of the test mode select input signal sampled at the rising edge of tck controls the sequence of tap controller state changes. trst# i when asserted, the test reset input allows the tap controller to be asynchronously initialized. vcc2det# n/a differentiate between the pentium processor with mmx technology and the low- power embedded pentium processor with mmx technology. this is an internal no connect (inc) pin on the low-power embedded pentium processor with mmx technology. this pin is not defined on the hl-pbga package. v cc2 i these pins are the power inputs to the core: 1.9 v input for 166/266 mhz ppga; 1.8 v for 166 mhz hl-pbga; 2.0 v for 166 mhz hl-pbga. v cc3 i these pins are the 2.5 v power inputs to the i/o. v ss i these pins are the ground inputs. w/r# o write/read is one of the primary bus cycle definition pins. it is driven valid in the same clock as the ads# signal is asserted. w/r# distinguishes between write and read cycles. wb/wt# i the writeback/writethrough input allows a data cache line to be defined as writeback or writethrough on a line-by-line basis. as a result, it determines whether a cache line is initially in the s or e state in the data cache. table 6. quick pin reference (sheet 6 of 6) symbol type name and function low-power embedded pentium ? processor with mmx? technology advance information datasheet 29 3.7 the cpuid instruction the cpuid instruction allows software to determine the type and features of the processor on which it is executing. when executing cpuid, the low-power embedded pentium processor with mmx technology behaves like the pentium processor and the pentium processor with mmx technology as follows: ? if the value in eax is 0, then the 12-byte ascii string genuine intel (little endian) is returned in ebx, edx and ecx. also, a 1 is returned to eax. ? if the value in eax is 1, then the processor version is returned in eax and the processor capabilities are returned in edx. the values of eax and edx for the low-power embedded pentium processor with mmx technology are given below. ? if the value in eax is neither 0 nor 1, the low-power embedded pentium processor with mmx technology writes 0 to all registers. the following eax and edx values are defined for the cpuid instruction executed with eax = 1. the processor version eax bit assignments are given in figure 6. the edx bit assignments are shown in figure 7. table 7. bus frequency selection bf2 bf1 bf0 bus/core ratio max bus/core frequency (mhz) 0 0 0 2/5 66/166 1 0 0 1/4 66/266 note: all other bf2Cbf0 settings are reserved on the low-power embedded pentium processor with mmx technology. figure 6. eax bit assignments for cpuid figure 7. edx bit assignments for cpuid 000250 0 (reserved) type family model stepping 31 14 13 12 11 8 7 4 3 0 000251 31 reserved 24 23 m m x 22 reserved 16 15 c m o v 14 m c a 13 p g e 12 m t r r 11 rsvd 10 9 a p i c 8 c x s 7 m c e 6 p a e 5 m s r 4 t s c 3 p s e 2 e d 1 v m e 0 f p u low-power embedded pentium ? processor with mmx? technology 30 advance information datasheet the type field for low-power embedded pentium processor with mmx technology is the same as pentium processor with mmx technology (type = 00h). the family field is the same as all other pentium processors (family = 5h). however, the model field is different: the pentium processor model number is 2h, the pentium processor with mmx technology model number is 4h, and the low-power embedded pentium processor with mmx technology model number is 8h. the stepping field indicates the revision number of a model. the stepping id of a-step for the low- power embedded pentium processor with mmx technology is 1h. stepping id will be documented in the low-power embedded pentium processor with mmx technology stepping information. after masking the reserve bits, all low-power embedded pentium processor with mmx technology-based products will get a value of 0x008003bf (assuming the apic is enabled at boot), or 0x008001bf (when the apic is disabled, using the apicen boot pin) in edx upon completion of the cpuid instruction. table 8. edx bit assignment definitions for cpuid bit value comments 0 1 fpu: floating-point unit on-chip 1 1 vme: virtual-8086 mode enhancements 2 1 de: debugging extensions 3 1 pse: page size extension 4 1 tsc: time stamp counter 5 1 msr pentium ? processor msr 6 0 pae: physical address extension 7 1 mce: machine check exception 8 1 cx8: cmpxchg8b instruction 9 1 apic: apic on-chip ? 10C11 r reserved C do not write to these bits or rely on their values 12 0 mtrr: memory type range registers 13 0 pge: page global enable 14 0 mca: machine check architecture 15C22 r reserved C do not write to these bits or rely on their values 23 1 intel architecture with mmx? technology supported 24C31 r reserved C do not write to these bits or rely on their values ? indicates that apic is present and hardware enabled (software disabling does not affect this bit). low-power embedded pentium ? processor with mmx? technology advance information datasheet 31 3.8 boundary scan chain list the boundary scan chain list for the low-power embedded pentium processor with mmx technology is different than the pentium processor with mmx technology due to the removal of some pins. the boundary scan register for the low-power embedded pentium processor with mmx technology contains a cell for each pin. following is the bit order of the low-power embedded pentium processor with mmx technology boundary scan register (left to right, top to bottom): tdi ? disapsba ? , picd1, picd0, reserved, picclk, d0, d1, d2, d3, d4, d5, d6, d7, dp0, d8, d9, d10, d11, d12, d13, d14, d15, dp1, d16, d17, d18, d19, d20, d21, d22, d23, dp2, d24, d25, d26, d27, d28, d29, d30, d31, dp3, d32, d33, d34, d35, d36, d37, d38, d39, dp4, d40, d41, d42, d43, d44, d45, d46, diswr ? , d47, dp5, d48, d49, d50, d51, d52, d53, d54, d55, dp6, d56, d57, d58, d59, d60, d61, d62, d63, dp7, ierr#, ferr#, pm0bp0, pm1bp1, bp2, bp3, mio#, cache#, ewbe#, inv, ahold, ken#, brdyc#, brdy#, boff#, na#, wbwt#, hold, disbus ? , disbusl ? , dismisc ? , dismisca ? , smiact#, prdy, pchk#, apchk#, breq, hlda, ap, lock#, pcd, pwt, dc#, eads#, ads#, hitm#, hit#, wr#, buschk#, flush#, a20m#, be0#, be1#, be2#, be3#, be4#, be5#, be6#, be7#, scyc, clk, reset, disabus ? , a20, a19, a18, a17, a16, a15, a14, a13, a12, a11, a10, a9, a8, a7, a6, a5, a4, a3, a31, a30, a29, a28, a27, a26, a25, a24, a23, a22, a21, nmi, rs#, intr, smi#, ignne#, init, pen#, reserved, bf0, bf1, bf2, stpclk#, reserved, reserved, reserved, reserved ? tdo reserved includes the no connect nc signals on the low-power embedded pentium processor with mmx technology. the cells marked with a dagger (?) are control cells that are used to select the direction of bi- directional pins or three-state the output pins. if 1 is loaded into the control cell, the associated pin(s) are three-stated or selected as input. the following lists the control cells and their corresponding pins: disabus: a31Ca3, ap disbus: be7#Cbe0#, cache#, scyc, m/io#, d/c#, w/r#, pwt, pcd disbusl: ads#, lock#, adsc# dismisc: apchk#, pchk#, prdy, bp3, bp2, pm1/bp1, pm0/bp0, ferr#, smiact#, breq, hlda, hit#, hitm# dismisca: ierr# diswr: d63Cd0, dp7Cdp0 disapsba: picd1Cpicd0 low-power embedded pentium ? processor with mmx? technology 32 advance information datasheet 3.9 pin reference tables table 9. output pins name (1) active level when floated ads# low bus hold, boff# apchk# low be7# C be4# low bus hold, boff# breq high cache# low bus hold, boff# ferr# low hit# low hitm# (2) low hlda high ierr# low lock# low bus hold, boff# m/io#, d/c#, w/r# n/a bus hold, boff# pchk# low bp3 C bp2, pm1/bp1, pm0/bp0 high prdy high pwt, pcd high bus hold, boff# scyc high bus hold, boff# smiact# low tdo n/a all states except shift-dr and shift-ir vcc2det# (3) n/a differentiates between the pentium ? processor with mmx? technology and the low-power embedded pentium processor with mmx technology note: 1. all output and input/output pins are floated during three-state test mode (except tdo). 2. hitm# pin has an internal pull-up resistor. 3. this pin is not on the hl-pbga pinout. low-power embedded pentium ? processor with mmx? technology advance information datasheet 33 table 10. input pins name active level synchronous/ asynchronous internal resistor qualified a20m# low asynchronous ahold high synchronous bf0 n/a synchronous/reset pulldown bf1 n/a synchronous/reset pullup bf2 n/a synchronous/reset pulldown boff# low synchronous brdy# low synchronous pullup bus state t2,t12,t2p buschk# low synchronous pullup brdy# clk n/a eads# low synchronous ewbe# low synchronous brdy# flush# low asynchronous hold high synchronous ignne# low asynchronous init high asynchronous intr high asynchronous inv high synchronous eads# ken# low synchronous first brdy#/na# na# low synchronous bus state t2,td,t2p nmi high asynchronous pen# low synchronous brdy# picclk high asynchronous pullup r/s# n/a asynchronous pullup reset high asynchronous smi# low asynchronous pullup stpclk# low asynchronous pullup tck n/a pullup tdi n/a synchronous/tck pullup tck tms n/a synchronous/tck pullup tck trst# low asynchronous pullup wb/wt# n/a synchronous first brdy#/na# low-power embedded pentium ? processor with mmx? technology 34 advance information datasheet 3.10 pin grouping according to function table 11. input/output pins name active level when floated (1) qualified (when an input) internal resistor a31 C a3 n/a address hold, bus hold, boff# eads# ap n/a address hold, bus hold, boff# eads# be3# C be0# low bus hold, boff# reset pulldown (2) d63 C d0 n/a bus hold, boff# brdy# dp7 C dp0 n/a bus hold, boff# brdy# picd0 n/a pullup picd1[apicen] n/a pulldown note: 1. all output and input/output pins are floated during three-state test mode (except tdo). 2. be3# C be0# have pulldowns during reset only. table 12. pin functional grouping function pins clock clk initialization reset, init, bf[2:0] address bus a31 C a3, be7# C be0# address mask a20m# data bus d63 C d0 address parity ap, apchk# apic support picclk, picd0 C picd1 data parity dp7 C dp0, pchk#, pen# internal parity error ierr# system error buschk# bus cycle definition m/io#, d/c#, w/r#, cache#, scyc, lock# bus control ads#, brdy#, na# page cacheability pcd, pwt cache control ken#, wb/wt# cache snooping/consistency ahold, eads#, hit#, hitm#, inv cache flush flush# write ordering ewbe# bus arbitration boff#, breq, hold, hlda interrupts intr, nmi floating-point error reporting ferr#, ignne# system management mode smi#, smiact# tap port tck, tms, tdi, tdo, trst# breakpoint/performance monitoring pm0/bp0, pm1/bp1, bp3 C bp2 clock control stpclk# debugging r/s#, prdy low-power embedded pentium ? processor with mmx? technology advance information datasheet 35 3.11 mechanical specifications in mechanical terms, the low-power embedded pentium processor with mmx technology 296-lead plastic staggered pin grid array (ppga) is completely identical to the pentium processor with mmx technology ppga package. the pins are arranged in a 37x37 matrix and the package dimensions are 1.95" x 1.95" (4.95 cm x 4.95 cm). package summary information for the ppga device is provided in table 13. figure 8 shows the package dimensions. the hl-pbga version of the low-power embedded pentium processor with mmx technology is a new package type for the pentium processor family. package summary information for the hl- pbga device is provided in table 14. figure 9 shows the package dimensions. 3.11.1 ppga package mechanical diagrams figure 8. ppga package dimensions a5771-01 1.65 (ref) d 2 b f f 2 1 e 1 a l seating plane 2 d d d 1 s 1 a a 1 2.29 1.52 45 chamfer (index corner) pin c3 measurements in mm ? chip capacitor solder resist heat slug low-power embedded pentium ? processor with mmx? technology 36 advance information datasheet table 13. ppga package dimensions symbol millimeters inches min max min max a 2.72 3.33 0.107 0.131 a1 1.83 2.23 0.072 0.088 a2 1.00 nominal 0.039 nominal b 0.40 0.51 0.016 0.020 d 49.43 49.63 1.946 1.954 d1 45.59 45.85 1.795 1.805 d2 23.44 23.95 0.923 0.943 el 2.29 2.79 0.090 0.110 l 3.05 3.30 0.120 0.130 n 296 296 s1 1.52 2.54 0.060 0.100 low-power embedded pentium ? processor with mmx? technology advance information datasheet 37 3.11.2 hl-pbga package mechanical diagrams figure 9 shows the ceramic hl-pbga package. the dimensions are listed in table 14. figure 9. hl-pbga package dimensions table 14. hl-pbga package dimensions symbol millimeters min max a1.411.67 a 1 0.56 0.70 b0.600.90 c0.850.97 d 34.90 35.10 e 34.90 35.10 e 1.27 s 1 1.63 ref a5830-01 pin #1 corner d e pin #1 i.d. 1.0 dia. b pin #1 corner s 1 e a 1 a c top view bottom view side view seating plane 1. all dimensions are in millimeters note: low-power embedded pentium ? processor with mmx? technology 38 advance information datasheet 3.12 thermal specifications the low-power embedded pentium processor with mmx technology is specified for proper operation when case temperature, t case (t c ), is within the specified range of 0 c to 85 c for the ppga package, and 0 c to 95 c for the hl-pbga package. the low-power embedded pentium processor with mmx technology in the hl-pbga package is also available in extended temperature ranges from -40c to +115c. for more information, see the extended temperature pentium ? processor with mmx? technology datasheet, order number 273232. 3.12.1 measuring thermal values to verify that the proper t c is maintained, it should be measured at the center of the package top surface (opposite of the pins). the measurement is made in the same way with or without a heatsink attached. when a heatsink is attached, a hole (smaller than 0.150" diameter) should be drilled through the heatsink to allow probing the center of the package. see figure 10 for an illustration of how to measure t c . to minimize the measurement errors, it is recommended to use the following approach: ? use 36-gauge or finer diameter k, t, or j type thermocouples. the laboratory testing was done using a thermocouple made by omega* (part number 5tc-ttk-36-36). ? attach the thermocouple bead or junction to the center of the package top surface using high thermal conductivity cements. the laboratory testing was done by using omega bond (part number ob-101). ? the thermocouple should be attached at a 90-degree angle as shown in figure 10. ? the hole size should be smaller than 0.150" in diameter. ? make sure there is no contact between thermocouple cement and heatsink base. the contact will affect the thermocouple reading. 3.12.2 thermal equations and data for the low-power embedded pentium processor with mmx technology, an ambient temperature, t a (air temperature around the processor), is not specified directly. the only restriction is that t c is met. the equation used to calculate q ca is: where: q ca = t c C t a p t a and t c = ambient and case temperature (c) q ca = case-to-ambient thermal resistance (c/watt) p = maximum power consumption (watt) low-power embedded pentium ? processor with mmx? technology advance information datasheet 39 q jc is thermal resistance from die to package case. q jc values shown in tables 15 and 16 are typical values. the actual q jc values depend on actual thermal conductivity and process of die attach. q ca is thermal resistance from package case to the ambient. q ca values shown in these tables are typical values. the actual q ca values depend on the heatsink design, interface between heatsink and package, airflow in the system, and thermal interactions between processor and surrounding components through pcb and the ambient. 3.12.3 airflow calculations for maximum and typical power below is an example of determining the airflow required during maximum power consumption for the 166 mhz low-power embedded pentium processor with mmx technology assuming an ambient air temperature of 50 c: t c (hl-pbga) = 95 c t a = 50 c p hl-pbga = 4.1 w q ca (hl-pbga, without heat sink) = 10.98 c/w figure 12 indicates that this example would require about 175 lfm without a heat sink, and about 25 lfm with a heat sink in the vertical orientation. below is an example of determining the airflow required during typical power consumption for the 166 mhz low-power embedded pentium processor with mmx technology assuming an ambient air temperature of 50 c: t c (hl-pbga) = 95 c t a = 50 c p hl-pbga = 2.9 w q ca (hl-pbga, without heat sink) = 15.52 c/w figure 12 indicates that this example would require about 0 lfm without a heat sink. a heat sink may not be necessary for typical power and 50 c ambient conditions. figure 10. technique for measuring t c 000262 low-power embedded pentium ? processor with mmx? technology 40 advance information datasheet 3.12.4 ppga package thermal resistance information table 15 lists the q jc and q ca values for the low-power embedded pentium processor with mmx technology in the ppga package with passive heatsinks. table 15. thermal resistances for ppga packages heatsink height q jc q ca ( c/watt) vs. laminar airflow (linear ft/min) (inches) (c/watt) 0 100 200 400 600 800 0.25 0.5 8.9 7.8 6.4 4.3 3.4 2.8 0.35 0.5 8.6 7.3 5.8 3.8 3.1 2.6 0.45 0.5 8.2 6.8 5.1 3.4 2.7 2.3 0.55 0.5 7.9 6.3 4.5 3.0 2.4 2.1 0.65 0.5 7.5 5.8 4.1 2.8 2.2 1.9 0.80 0.5 6.8 5.1 3.7 2.6 2.0 1.8 1.00 0.5 6.1 4.5 3.4 2.4 1.9 1.6 1.20 0.5 5.7 4.1 3.1 2.2 1.8 1.6 1.40 0.5 5.2 3.7 2.8 2.0 1.7 1.5 none 1.3 12.9 12.2 11.2 7.7 6.3 5.4 notes: 1. heatsinks are omni-directional pin aluminum alloy. 2. features were based on standard extrusion practices for a given height: pin size ranged from 50 to 129 mils; pin spacing ranged from 93 to 175 mils; base thickness ranged from 79 to 200 mils. 3. heatsink attach was 0.005" of thermal grease. attach thickness of 0.002" will improve performance by approximately 0.3 watt. figure 11. thermal resistance vs. heatsink height, ppga packages 10 9 8 7 6 5 4 3 2 1 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 heatsink height (inches) 0 100 200 400 600 800 airflow rate (lfm) q (c/watt) ca low-power embedded pentium ? processor with mmx? technology advance information datasheet 41 3.12.5 hl-pbga package thermal resistance information table 16 lists the q jc values for the low-power embedded pentium processor with mmx technology in the hl-pbga package. the thermal data collection conditions were: ? a bidirectional anodized aluminum alloy heat sink was used. ? heat sink height was 7mm. ? in the horizontal orientation the component was mounted flush with the motherboard. ? in the vertical orientation the component was mounted on an add-in card perpendicular to the motherboard. table 16. thermal resistances for hl-pbga packages heatsink/ orientation q jc ( c/watt) q ca (c/watt) vs. laminar airflow (linear ft/min) 0 100 200 400 600 no heat sink 0.76 15.66 12.33 10.3 8.85 7.89 horizontal 0.76 12.09 8.57 6.52 4.82 4.06 vertical 0.76 11.33 8.34 6.38 4.69 3.95 figure 12. thermal resistance vs. airflow for hl-pbga package 0 2 4 6 8 10 12 14 16 18 0 100 200 300 400 500 600 airflow (lfm) q ca (c/w) horizontal heat sink vertical heat sink no heat sink low-power embedded pentium ? processor with mmx? technology 42 advance information datasheet 4.0 electrical specifications this section contains preliminary information on new products in production. the specifications are subject to change without notice. 4.1 absolute maximum ratings warning: the following values are stress ratings only. functional operation at the maximum ratings is not implied nor guaranteed. functional operating conditions are given in the ac and dc specification tables. stressing the device beyond the absolute maximum ratings may cause permanent damage. extended exposure to the maximum ratings may affect device reliability. furthermore, although the pentium processor with mmx technology contains protective circuitry to resist damage from electrostatic discharge (esd), always take precautions to avoid high static voltages or electric fields. 4.2 dc specifications tables 19, 20, 21 and 22 list the dc specifications which apply to the low-power embedded pentium processor with mmx technology. 4.2.1 power sequencing there is no specific sequence required for powering up or powering down the v cc2 and v cc3 power supplies. however, it is recommended that the v cc2 and v cc3 power supplies be either both on or both off within one second of each other. the i/o voltage v cc3 is 2.5 v. the core voltage v cc2 is 1.9 v for ppga. the core voltage v cc2 for the hl-pbga package type is 1.8 v (166 mhz) or 2.0 v (266 mhz). table 17. absolute maximum ratings parameter maximum rating case temperature under bias - 65 c to 110 c storage temperature - 65 c to 150 c v cc3 supply voltage with respect to v ss - 0.5 v to +3.2 v v cc2 supply voltage with respect to v ss - 0.5 v to +2.8 v 2.5 v only buffer dc input voltage - 0.5 v to v cc3 +0.5 v (not to exceed v cc3 max) note: the low-power embedded pentium processor with mmx technology in the hl-pbga package is also available in extended temperature ranges from -40c to +115c. for more information, see the extended temperature pentium ? processor with mmx? technology datasheet, order number 273232. low-power embedded pentium ? processor with mmx? technology advance information datasheet 43 the values in table 20 should be used for power supply design. the values were determined using a worst case instruction mix and maximum v cc . power supply transient response and decoupling capacitors must be sufficient to handle the instantaneous current changes occurring during transitions from stop clock to full active modes. table 18. v cc and t case specifications package t case supply min voltage max voltage voltage tolerance frequency ppga 0c to 85c v cc2 1.750 v 2.04 v 1.9 v 7.5% 166/266 mhz v cc3 2.375 v 2.625 v 2.5 v 5% 166/266 mhz hl-pbga 0c to 95c v cc2 1.665 v 1.935 v 1.8 v 7.5% 166 mhz v cc2 1.85 v 2.15 v 2.0 v 7.5% 266 mhz v cc3 2.375 v 2.625 v 2.5 v 5% 166/266 mhz table 19. dc specifications symbol parameter min max unit notes v il3 input low voltage C 0.3 0.5 v v ih3 input high voltage v cc3 C 0.7 v cc3 + 0.3 v ttl level v ol3 output low voltage 0.4 v ttl level, (1) v oh3 output high voltage v cc3 C 0.4 v cc3 C 0.2 v v ttl level, (2) ttl level, (3) notes: 1. parameter measured at - 4ma. 2. parameter measured at 3 ma. 3. parameter measured at 1 ma; not 100% tested, guaranteed by design. table 20. i cc specifications symbol parameter min max unit notes i cc2 power supply current 2.35 (hl-pbga) 2.5 (ppga) 4.00 a a a 166 mhz 166 mhz 266 mhz i cc3 power supply current 0.38 0.38 a a 166 mhz 266 mhz low-power embedded pentium ? processor with mmx? technology 44 advance information datasheet table 21. power dissipation requirements for thermal design parameter typical (1) max (2) unit frequency thermal design power 4.1 (hl-pbga) 4.5 (ppga) 7.6 watts watts watts 166 mhz 166 mhz 266 mhz active power (3) 2.9 4.5 watts watts 166 mhz 266 mhz stop grant/auto halt powerdown power dissipation (4) 0.70 0.70 watts watts 166 mhz 266 mhz stop clock power (5) 0.06 0.06 watts watts 166 mhz 266 mhz notes: 1. this is the typical power dissipation in a system. this value is expected to be the average value that will be measured in a system using a typical device at the specified voltage running typical applications. this value is dependent upon the specific system configuration. typical power specifications are not tested. 2. systems must be designed to thermally dissipate the maximum thermal design power unless the system uses thermal feedback to limit processors maximum power. the maximum thermal design power is determined using a worst-case instruction mix and also takes into account the thermal time constant of the package. 3. active power is the average power measured in a system using a typical device running typical applications under normal operating conditions at nominal v cc and room temperature. 4. stop grant/auto halt powerdown power dissipation is determined by asserting the stpclk# pin or executing the halt instruction. when in this mode, the processor has a new feature which allows it to power down additional circuitry to enable lower power dissipation. this is the power without snooping at the specified voltage and with tr12 bit 21 set. in order to enable this feature, tr12 bit 21 must be set to 1 (the default is 0 or disabled). stop grant/auto halt powerdown power dissipation without tr12 bit 21 set may be higher. the max rating may be changed in future specification updates. 5. stop clock power dissipation is determined by asserting the stpclk# pin and then removing the external clk input. this is specified at a t case of 50 c. table 22. input and output characteristics symbol parameter min max unit notes c in input capacitance 15 pf (4) c o output capacitance 20 pf (4) c i/o i/o capacitance 25 pf (4) c clk clk input capacitance 15 pf (4) c tin test input capacitance 15 pf (4) c tout test output capacitance 20 pf (4) c tck test clock capacitance 15 pf (4) i li input leakage current 15 a 0 low-power embedded pentium ? processor with mmx? technology 46 advance information datasheet 4.3.3 connection specifications all nc/inc pins must remain unconnected. for reliable operation, always connect unused inputs to an appropriate signal level. unused active low inputs should be connected to v cc3 . unused active high inputs should be connected to ground. 4.3.4 ac timings the ac specifications given in table 23 consist of output delays, input setup requirements and input hold requirements for the standard 66 mhz external bus. all ac specifications (with the exception of those for the tap signals and apic signals) are relative to the rising edge of the clk input. all timings are referenced to v cc3 /v cc2 for both 0 and 1 logic levels unless otherwise specified. within the sampling window, asynchronous inputs must be stable for correct operation. each valid delay is specified for a 0 pf load. the system designer should use i/o buffer modeling to account for signal flight time delays. do not select a bus fraction and clock speed which will cause the processor to exceed its internal maximum frequency. the following specifications apply to all standard ttl signals used with the pentium processor family: ? ttl input test waveforms are assumed to be 0 to 2.5 v transitions with 1.0 v/ns rise and fall times. ? 0.3 v/ns input rise/fall time 5v/ns. ? all ttl timings are referenced from v cc3 /v cc2 . low-power embedded pentium ? processor with mmx? technology advance information datasheet 47 table 23. low-power embedded pentium ? processor with mmx? technology ac specifications (sheet 1 of 3) (see table 18 for v cc and t case assumptions.) symbol parameter min max unit figure notes (see table 25) clk frequency 33.33 66.6 mhz (1) t 1a clk period 15.0 30.0 ns 13 t 1b clk period stability 250 ps (2, 3) t 2 clk high time 4.0 ns 13 @v cc3 C 0.7 v, (2) t 3 clk low time 4.0 ns 13 @0.5 v, (2) t 4 clk fall time 0.15 1.5 ns 13 v cc3 C 0.7 v to 0.5 v, (2, 4) t 5 clk rise time 0.15 1.5 ns 13 0.5 v to v cc3 C0.7 v, (2, 4) t 6a pwt, pcd, cache# valid delay 1.0 7.0 ns 14 t 6b ap valid delay 1.0 8.5 ns 14 t 6c lock#, valid delay 0.9 7.0 ns 14 t 6d ads# valid delay 1.0 6.2 ns 14 t 6e a31Ca3 valid delay 0.8 6.4 ns 14 t 6f m/io# valid delay 0.8 6.2 ns 14 t 6g be7#Cbe0#, d/c#, w/ r#, scyc valid delay 0.8 7.0 ns 14 t 7 ads#, ap, a31Ca3, pwt, pcd, be7#Cbe0#, m/io#, d/c#, w/r#, cache#, scyc, lock# float delay 10.0 ns 15 (2) t 8a apchk#, ierr#, ferr# valid delay 1.0 8.3 ns 14 (5) t 8b pchk# valid delay 1.0 7.0 ns 14 (5) t 9a breq valid delay 1.0 8.0 ns 14 (5) t 9b smiact# valid delay 1.0 7.3 ns 14 (5) t 9c hlda valid delay 1.0 6.8 ns 14 (5) t 10a hit# valid delay 1.0 6.8 ns 14 t 10b hitm# valid delay 0.9 6.0 ns 14 t 11a pm1Cpm0, bp3Cbp0 valid delay 1.0 10.0 ns 14 t 11b prdy valid delay 1.0 8.0 ns 14 t 12 d63Cd0, dp7Cdp0 write data valid delay 1.0 7.7 ns 14 t 13 d63Cd0, dp3C0 write data float delay 10.0 ns 15 (2) t 14 a31Ca5 setup time 6.0 ns 16 (6) t 15 a31Ca5 hold time 1.0 ns 16 t 16a inv, ap setup time 5.0 ns 16 t 16b eads# setup time 5.0 ns 16 t 17 eads#, inv, ap hold time 1.0 ns 16 low-power embedded pentium ? processor with mmx? technology 48 advance information datasheet t 18a ken# setup time 5.0 ns 16 t 18b na#, wb/wt# setup time 4.5 ns 16 t 19 ken#, wb/wt#, na# hold time 1.0 ns 16 t 20 brdy# setup time 4.75 ns 16 t 21 brdy# hold time 1.0 ns 16 t 22 ahold, boff# setup time 5.5 ns 16 t 23 ahold, boff# hold time 1.0 ns 16 t 24a buschk#, ewbe#, hold, setup time 5.0 ns 16 t 24b pen# setup time 4.8 ns 16 t 25a buschk#, ewbe#, pen# hold time 1.0 ns 16 t 25b hold hold time 1.5 ns 16 t 26 a20m#, intr, stpclk# setup time 5.0 ns 16 (7, 8) t 27 a20m#, intr, stpclk# hold time 1.0 ns 16 (9) t 28 init, flush#, nmi, smi#, ignne# setup time 5.0 ns 16 (8, 10, 17) t 29 init, flush#, nmi, smi#, ignne# hold time 1.0 ns 16 (9) t 30 init, flush#, nmi, smi#, ignne# pulse width, async 2.0 clks 16 (10, 11) t 31 r/s# setup time 5.0 ns 16 (7, 8, 10) t 32 r/s# hold time 1.0 ns 16 (9) t 33 r/s# pulse width, async. 2.0 clks 16 (10, 11) t 34 d63Cd0, dp7C0 read data setup time 2.8 ns 16 t 35 d63Cd0, dp7C0 read data hold time 1.5 ns 16 t 36 reset setup time 5.0 ns 16 (7, 8) t 37 reset hold time 1.0 ns 17 (9) t 38 reset pulse width, v cc & clk stable 15.0 clks 17 (10) t 39 reset active after v cc & clk stable 1.0 ms 17 power up table 23. low-power embedded pentium ? processor with mmx? technology ac specifications (sheet 2 of 3) (see table 18 for v cc and t case assumptions.) symbol parameter min max unit figure notes (see table 25) low-power embedded pentium ? processor with mmx? technology advance information datasheet 49 t 40 reset configuration signals (init, flush#) setup time 5.0 ns 17 (7, 8, 10) t 41 reset configuration signals (init, flush#) hold time 1.0 ns 17 (9) t 42a reset configuration signals (init, flush#) setup time, async. 2.0 clks 17 to reset falling edge, (8) t 42b reset configuration signals (init, flush#) setup time, async. 2.0 clks 17 to reset falling edge t 43a bf2Cbf0 setup time 1.0 ms 17 to reset falling edge, (10) t 43b bf2Cbf0 hold time 2.0 clks 17 to reset falling edge, (12) t 43c apicen, be4# setup time 2.0 clks 17 to reset falling edge t 43d apicen, be4# hold time 2.0 clks 17 to reset falling edge t 44 tck frequency 16.0 mhz t 45 tck period 62.5 ns 13 t 46 tck high time 25.0 ns 13 @v cc3 C0.7 v, (2) t 47 tck low time 25.0 ns 13 @0.5 v, (2) t 48 tck fall time 5.0 ns 13 v cc3 C0.7 v to 0.5 v (2, 13, 14) t 49 tck rise time 5.0 ns 13 0.5 v to v cc3 C0.7 v, (2, 13, 14) t 50 trst# pulse width 40.0 ns 19 asynchronous, (2) t 51 tdi, tms setup time 5.0 ns 19 (15) t 52 tdi, tms hold time 13.0 ns 19 (15) t 53 tdo valid delay 3.0 20.0 ns 19 (13) t 54 tdo float delay 25.0 ns 19 (2, 13) t 55 all non-test outputs valid delay 3.0 20.0 ns 19 (13, 16, 17) t 56 all non-test outputs float delay 25.0 ns 19 (2, 13, 16, 17) t 57 all non-test inputs setup time 5.0 ns 19 (15, 16, 17) t 58 all non-test inputs hold time 13.0 ns 19 (15, 16, 17) table 23. low-power embedded pentium ? processor with mmx? technology ac specifications (sheet 3 of 3) (see table 18 for v cc and t case assumptions.) symbol parameter min max unit figure notes (see table 25) low-power embedded pentium ? processor with mmx? technology 50 advance information datasheet table 24. apic ac specifications symbol parameter min max unit figure notes t 60a picclk frequency 2 16.66 mhz t 60b picclk period 60 500 ns 13 t 60c picclk high time 15 ns 13 t 60d picclk low time 15 ns 13 t 60e picclk rise time 0.15 2.5 ns 13 t 60f picclk fall time 0.15 2.5 ns 13 t 60g picd0C1 setup time 3 ns 16 to picclk t 60h picd0C1 hold time 2.5 ns 16 to picclk t 60i picd0C1 valid delay (l to h) 4 38 ns 14 from picclk, (18) t 60j picd0C1 high time (h to l) 4 22 ns 14 from picclk, (18) t 61 picclk setup time 5.0 16 to clk t 62 picclk hold time 2.0 16 to clk t 63 picclk ratio (clk/picclk) 4 (19) table 25. notes to tables 23 and 24 1. clk input frequency must be either 33.33 mhz (+1 mhz) or 66.6 mhz (C1 mhz). operation in the range between 33.33 mhz and 66.6 mhz is not supported. 2. not 100 percent tested. guaranteed by design. 3. these signals are measured on the rising edge of adjacent clks at v cc3 /v cc2 . to ensure a 1:1 relationship between the amplitude of the input jitter and the internal and external clocks, the jitter frequency spectrum should not have any power spectrum peaking between 500 khz and 1/3 of the clk operating frequency. the amount of jitter present must be accounted for as a component of clk skew between devices. the internal clock generator requires a constant frequency clk input to within +250 ps, and therefore the clk input cannot be changed dynamically. 4. 0.87 v/ns clk input rise/fall time 8.7 v/ns. 5. apchk#, ferr#, hlda, ierr#, lock#, and pchk# are glitch-free outputs. glitch-free signals monotonically transition without false transitions. 6. timing (t 14 ) is required for external snooping (e.g., address setup to the clk in which eads# is sampled active). 7. setup time is required to guarantee recognition on a specific clock. 8. this input may be driven asynchronously. 9. hold time is required to guarantee recognition on a specific clock. 10.when driven asynchronously, reset, nmi, flush#, r/s#, init, and smi# must be de-asserted (inactive) for a minimum of two clocks before being returned active. 11.to guarantee proper asynchronous recognition, the signal must have been de-asserted (inactive) for a minimum of two clocks before being returned active and must meet the minimum pulse width. 12.bf2Cbf0 should be strapped to v cc3 or v ss . 13.referenced to tck falling edge. 14.1 ns can be added to the maximum tck rise and fall times for every 10 mhz of frequency below 33 mhz. 15.referenced to tck rising edge. 16.non-test outputs and inputs are the normal output or input signals (besides tck, trst#, tdi, tdo, and tms). these timings correspond to the response of these signals due to boundary scan operations. 17.during probe mode operation, do not use the boundary scan timings (t 55 Ct 58 ). 18.this assumes an external pull-up resistor to v cc and a lumped capacitive load. the pull-up resistor must be between 300 w and 1 k w , the capacitance must be between 20 pf and 120 pf, and the rc product must be between 6 ns and 36 ns. 19.the clk to picclk ratio has to be an integer and the ratio (clk/picclk) cannot be smaller than 4. low-power embedded pentium ? processor with mmx? technology advance information datasheet 51 figure 13. clock waveform figure 14. valid delay timings figure 15. float delay timings pp 005 1 t x t w t y t z t v t v t w t x t y t z = = = = = t5, t49, t60e t4, t48, t60f t2, t46, t60c t1, t45, t60b t3, t47, t60d vcc3-0.7v 0.5v pp0052 t x = t6 , t8 , t9 , t10 , t11 , t12 , t60i si g nal valid t max. x t min. x vcc3/2 vcc3/2 signal signal vcc3/2 t y t x t x = t7, t13 t y = t6min, t12min low-power embedded pentium ? processor with mmx? technology 52 advance information datasheet figure 16. setup and hold timings figure 17. reset and configuration timings clk signal valid vcc3/2 t x = t14, t16, t18, t20, t22, t24, t26, t28, t31, t34, t60g (to picclk), t61 t y = t15, t17, t19, t21, t23, t25, t27, t29, t32, t35, t60h (to picclk), t62 t y t x clk reset config vcc3/2 vcc3/2 t z t t =t40 t v t t t u t x t w t y t u = t v =t37 w = x = t43b, t43d, t43f, t88 y = t z =t36 valid t41 t t t t38, t39 t42, t43c, t43e, t87 low-power embedded pentium ? processor with mmx? technology advance information datasheet 53 figure 18. test timings figure 19. test reset timings vcc3/2 t r = t57 tck tdi tms tdo output signals input signals t v t w t x t y t r t s t u t z t s =t58 t u =t54 t v =t51 t w =t52 t x =t53 t y =t55 t z =t56 vcc3/2 trst# t x =t50 t x low-power embedded pentium ? processor with mmx? technology 54 advance information datasheet 4.4 i/o buffer models this section describes the i/o buffer models of the low-power embedded pentium processor with mmx technology. the first order i/o buffer model is a simplified representation of the complex input and output buffers used. figure 20 shows the structure of the input buffer model and figure 21 shows the output buffer model. table 26 and 27 show the parameters used to specify these models. although simplified, these buffer models will accurately model flight time and signal quality. for these parameters, there is very little added accuracy in a complete transistor model. in addition to the input and output buffer parameters, input protection diode models are provided for added accuracy. these diodes have been optimized to provide esd protection and provide some level of clamping. although the diodes are not required for simulation, it may be more difficult to meet specifications without them. note, however, some signal quality specifications require that the diodes be removed from the input model. the series resistors (r s ) are a part of the diode model. remove these when removing the diodes from the input model. figure 20. first order input buffer model low-power embedded pentium ? processor with mmx? technology advance information datasheet 55 4.4.1 buffer model parameters this section gives the parameters for each input, output and bidirectional buffers. the input, output and bidirectional buffer values of the processor are listed in table 29. these tables contain listings for all three types, do not get them confused during simulation. when a bidirectional pin is operating as an input, use the c in , c p and l p values; if it is operating as a driver, use all of the data parameters. please refer to table 28 for the groupings of the buffers. the input, output and bidirectional buffers values are listed below. these tables contain listings for all three types. when a bidirectional pin is operating as an input, just use the c in , c p and l p values, if it is operating as a driver use all the data parameters. table 26. parameters used in the specification of the first order input buffer model parameter description c in minimum and maximum value of the capacitance of the input buffer model l p minimum and maximum value of the package inductance c p minimum and maximum value of the package capacitance r s diode series resistance d1, d2 ideal diodes figure 21. first order output buffer model table 27. parameters used in the specification of the first order output buffer model parameter description dv/dt minimum and maximum value of the rate of change of the open circuit voltage source used in the output buffer model r o minimum and maximum value of the output impedance of the output buffer model c o minimum and maximum value of the capacitance of the output buffer model l p minimum and maximum value of the package inductance c p minimum and maximum value of the package capacitance low-power embedded pentium ? processor with mmx? technology 56 advance information datasheet table 28. signal to buffer type signals type driver buffer type receiver buffer type a20m#, ahold, bf, boff#, brdy#, buschk#, eads#, ewbe#, flush#, hold, ignne#, init, intr, inv, ken#, na#, nmi, pen#, picclk, r/s#, reset, smi#, stpclk#, tck, tdi, tms, trst#, wb/wt# ier1 apchk#, be7Cbe5#, bp3Cbp2, breq, ferr#, ierr#, pcd, pchk#, pm0/bp0, pm1/bp1, prdy, pwt, smiact#, tdo oed1 a31Ca3, ap, be4#Cbe0#, cache#, d/c#, d63Cd0, dp8Cdp0, hlda, lock#, m/io#, scyc, ads#, hitm#, hit#, w/r#, picd0, picd1 i/o eb1 eb1 table 29. input, output and bidirectional buffer model parameters for ppga package buffer ty pe transition dv/dt (v/nsec) r o (ohms) c p (pf) l p (nh) c o /c in (pf) min max min max min max min max min max er1 rising 1.1 5.3 7.7 15.3 0.8 1.2 (input) falling 1.1 5.3 7.7 15.3 0.8 1.2 ed1 rising 2.2/2.2 2.7/0.15 21.6 65 1.1 5.8 8.1 16.3 2.0 2.6 (output) falling 2.2/2.9 2.7/0.22 17.5 75 1.1 5.8 8.1 16.3 2.0 2.6 eb1 rising 2.2/2.2 2.7/0.15 21.6 65 1.3 7.0 8.2 18.4 2.0 2.6 (bidir) falling 2.2/2.9 2.7/0.22 17.5 75 1.3 7.0 8.2 18.4 2.0 2.6 table 30. preliminary input, output and bidirectional buffer model parameters for hl-pbga package buffer type transition dv/dt (v/nsec) r o (ohms) c p (pf) l p (nh) c o /c in (pf) min max minmaxminmaxminmaxminmax er1 rising 0.2 0.4 6.4 11.3 0.8 1.2 (input) falling 0.2 0.4 6.4 11.3 0.8 1.2 ed1 rising 2.2/2.2 2.7/0.15 21.6 65 0.2 0.5 5.4 11.7 2.0 2.6 (output) falling 2.2/2.9 2.7/0.22 17.5 75 0.2 0.5 5.4 11.7 2.0 2.6 eb1 rising 2.2/2.2 2.7/0.15 21.6 65 0.2 0.4 5.2 10.3 2.0 2.6 (bidir) falling 2.2/2.9 2.7/0.22 17.5 75 0.2 0.4 5.2 10.3 2.0 2.6 note: the data in this table is based on preliminary design information. input, output and bidirectional buffer values are being characterized at this time. low-power embedded pentium ? processor with mmx? technology advance information datasheet 57 4.5 signal quality specifications signals driven by the system into the low-power embedded pentium processor with mmx technology must meet signal quality specifications to guarantee that the components read data properly and to ensure that incoming signals do not affect the reliability of the component. 4.5.1 overshoot the maximum overshoot and overshoot threshold duration specifications for inputs to the low- power embedded pentium processor with mmx technology are described as follows: ? maximum overshoot specification: the maximum overshoot of the clk/picclk signals should not exceed v cc2 , nominal +0.6 v. the maximum overshoot of all other input signals should not exceed v cc3 , nominal +1.0 v. ? overshoot threshold duration specification: the overshoot threshold duration is defined as the sum of all time during which the input signal is above v cc3 , nominal +0.3 v, within a single clock period. the overshoot threshold duration must not exceed 20% of the period. refer to table 32 for a summary of the overshoot specifications for the low-power embedded pentium processor with mmx technology. table 31. input buffer model parameters: d (diodes) symbol parameter d1 d2 i s saturation current 1.4e C 14a 2.78e C 16a n emission coefficient 1.19 1.00 r s series resistance 6.5 w 6.5 w t t transit time 3 ns 6 ns v j pn potential 0.983 v 0.967 v c j0 zero bias pn capacitance 0.281 pf 0.365 pf m pn grading coefficient 0.385 0.376 table 32. overshoot specification summary specification name value units notes threshold level v cc3 , nominal +0.3 v (1, 2) maximum overshoot level (clk and picclk) v cc3 , nominal +0.6 v (1, 2) maximum overshoot level (all other inputs) v cc3 , nominal +1.0 v (1, 2) maximum threshold duration 20% of clock period above threshold voltage ns (2) maximum ringback v cc3 , nominal C0.7 v (1, 2) notes: 1. v cc3 , nominal refers to the voltage measured at the v cc3 pins. 2. see figure 22 and figure 24. low-power embedded pentium ? processor with mmx? technology 58 advance information datasheet 4.5.2 undershoot the maximum undershoot and undershoot threshold duration specifications for inputs to the low- power embedded pentium processor with mmx technology are described as follows: ? maximum undershoot specification: the maximum undershoot of the clk/picclk signals must not drop below C0.6 v. the maximum undershoot of all other input signals must not drop below C1.0 v. ? undershoot threshold duration specification: the undershoot threshold duration is defined as the sum of all time during which the input signal is below C0.3 v within a single clock period. the undershoot threshold duration must not exceed 20% of the period. refer to table 33 for a summary of the undershoot specifications for the low-power embedded pentium processor with mmx technology. figure 22. maximum overshoot level, overshoot threshold level and overshoot threshold duration 000272 maximum overshoot level overshoot threshold level v , nominal cc3 overshoot threshold duration table 33. undershoot specification summary specification name value units notes threshold level C0.3 v (1) minimum undershoot level (clk and picclk) C0.6 v (1) minimum undershoot level (all other inputs) C1.0 v (1) maximum threshold duration 20% of clock period below threshold voltage ns (1) maximum ringback 0.5 v (1) note: 1. see figure 23 and figure 25. low-power embedded pentium ? processor with mmx? technology advance information datasheet 59 4.5.3 ringback excessive ringback can contribute to long-term reliability degradation of the low-power embedded pentium processor with mmx technology, and can cause false signal detection. ringback is simulated at the input pin of a component using the input buffer model. ringback can be simulated with or without the diodes that are in the input buffer model. ringback is the absolute value of the maximum voltage at the receiving pin below v cc3 (or above v ss ) relative to the v cc3 (or v ss ) level after the signal has reached its maximum voltage level. the input diodes are assumed present. if simulated without the input diodes, follow the maximum overshoot/undershoot specifications. by meeting the overshoot/undershoot specifications, the signal is guaranteed not to ringback excessively. if simulated with the diodes present in the input model, follow the maximum ringback specification. the maximum ringback specification for inputs to the low-power embedded pentium processor with mmx technology is described as follows: ? maximum ringback specification: the maximum ringback of inputs associated with their high states (overshoot) must not drop below v cc3 C1.0 v as shown in figure 24. similarly, the maximum ringback of inputs associated with their low states (undershoot) must not exceed 0.5 v as shown in figure 25. ? overshoot (undershoot) is the absolute value of the maximum voltage above v cc (below v ss ). the guideline assumes the absence of diodes on the input. figure 23. maximum undershoot level, undershoot threshold level and undershoot threshold duration 000273 maximum undershoot level undershoot threshold level v , nominal ss undershoot threshold duration low-power embedded pentium ? processor with mmx? technology 60 advance information datasheet 4.5.4 settling time the settling time is defined as the time a signal requires the receiver to settle within 10 percent of v cc3 or v ss . settling time is the maximum time allowed for a signal to reach within 10 percent of its final value. most available simulation tools are unable to simulate settling time so that it accurately reflects silicon measurements. second order, and other, effects on a physical board serve to dampen the signal at the receiver. because of these concerns, settling time is a recommendation or a tool for layout tuning and not a specification. to make sure that there is no impact on the flight times of the signals if the waveform has not settled, settling time is simulated at the slow corner. settling time may be simulated with the diodes included or excluded from the input buffer model. if diodes are included, settling time recommendations will be easier to meet. figure 24. maximum ringback associated with the signal high state figure 25. maximum ringback associated with the signal low state 000274 maximum ringback v , nominal cc3 000275 maximum undershoot level v , nominal ss low-power embedded pentium ? processor with mmx? technology advance information datasheet 61 although simulated settling time has not shown good correlation with physical, measured settling time, settling time simulations can still be used as a tool to tune layouts. use the following procedure to verify board simulation and tuning with concerns for settling time: 1. simulate settling time at the slow corner for a particular signal. 2. if settling time violations occur (signal requires more than 12.5 ns to settle to 10% of its final value), simulate signal trace with dc diodes in place at the receiver pin. the dc diode behaves almost identically to the actual (non-linear) diode on the part as long as excessive overshoot does not occur. 3. if settling time violations still occur, simulate flight times for five consecutive cycles for that particular signal. 4. if flight time values are consistent over the five simulations, settling time should not be a concern. if, however, flight times are not consistent over the five consecutive cycles, tuning of the layout is required. 5. note that, for signals that are allocated two cycles for flight time, the recommended settling time is doubled. maximum settling time to within 10 percent of v ih or v il is 12.5 ns at 66 mhz. 4.5.5 measurement methodology the waveform of the input signals should be measured at the processor pins using an oscilloscope with a 3 db bandwidth of at least 20 mhz (100 ms/s digital sampling rate). there should be a short isolation ground lead attached to a processor pin on the bottom side of the board. a 1-m w probe with loading of less than 1 pf is recommended. the measurement should be taken at the input pins and their nearest v ss pins. figure 26. settling time 000276 2.5v settling time v min C10% ih3 v max +10% ih3 low-power embedded pentium ? processor with mmx? technology 62 advance information datasheet 4.6 measuring maximum overshoot, undershoot and ringback the display should show continuous sampling (e.g., infinite persistence) of the waveform at 500 mv/div and 5 ns/div (for clk) or 20 ns/div (for other inputs) for a recommended duration of approximately five seconds. adjust the vertical position to measure the maximum overshoot and associated ringback with the largest possible granularity. similarly, readjust the vertical position to measure the maximum undershoot and associated ringback. there is no allowance for crossing the maximum overshoot, maximum undershoot or maximum ringback specifications. 4.7 measuring overshoot threshold duration a snapshot of the input signal should be taken at 500 mv/div and 500 ps/div (for clk) or 2 ns/div (for other inputs). adjust the vertical position and horizontal offset position to view the threshold duration. the overshoot threshold duration is defined as the sum of all time during which the input signal is above v cc3 nominal + 0.3 v within a single clock period. the overshoot threshold duration must not exceed 20% of the period. 4.8 measuring undershoot threshold duration a snapshot of the input signal should be taken at 500 mv/div and 500 ps/div (for clk) or 2 ns/div (for other inputs). adjust the vertical position and horizontal offset position to view the threshold duration. the undershoot threshold duration is defined as the sum of all time during which the clock signal is below C0.3 v within a single clock period. the undershoot threshold duration must not exceed 20% of the period. |
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